Job Objective/s
The Manufacturing Manager (ATP) is responsible for overseeing and managing backend manufacturing operations for Indium Phosphide (InP) laser devices, including wafer to die singulation, die handling, assembly, packaging, burn-in, and final testing. The role ensures high-yield, cost-effective, and on-time production while maintaining strict quality and reliability standards. The manager will lead a team of engineers, supervisors, and technicians to achieve operational excellence through continuous improvement, automation, and cross-functional collaboration.
Duties and Responsibilities
1. Operations Management
- Oversee daily backend manufacturing activities, covering wafer to die singulation, die attach, wire bonding, submount assembly, burn-in, and optical/electrical testing.
- Plan and execute production schedules to meet delivery, yield, and cost targets.
- Monitor key operational metrics (throughput, cycle time, yield, equipment uptime).
- Ensure full compliance with EHS, cleanroom, and ISO quality standards.
2. Process & Yield Optimization
- Drive process control and continuous improvement programs to improve yield, reduce rework, and enhance throughput.
- Work with process and equipment engineers to identify and eliminate bottlenecks.
- Implement SPC, DOE, and root cause analysis for performance optimization.
3. People Leadership
- Lead and develop a team of production supervisors, engineers, and technicians.
- Set performance goals, conduct evaluations, and drive skill development.
- Foster a culture of accountability, collaboration, and continuous improvement.
4. Equipment & Automation
- Oversee backend equipment utilization and maintenance programs.
- Work with equipment vendors and engineering teams on upgrades and automation initiatives.
- Support tool qualification, calibration, and preventive maintenance programs.
5. Quality & Reliability
- Collaborate with QA and Reliability Engineering to ensure compliance with product and customer specifications.
- Lead Corrective and Preventive Action (CAPA) programs, utilizing 8D methodology and structured root cause analysis to address non-conformances and implement sustainable solutions.
- Ensure robust traceability, documentation, and statistical process monitoring.
6. Cross-functional Collaboration
- Interface with Front-end Fab, NPD (New Product Development), NPI (New Product Introduction), and PPC (Product Planning Control) teams to ensure smooth technology transfer and production ramp-up.
- Support Engineering Change Notice (ECN), pilot builds, and new product introductions.
- Align with Planning and Procurement to ensure material readiness and capacity planning.
Qualification Guidelines
Minimum Education
Bachelor’s or Master’s degree in Materials Science, Electrical Engineering, Physics, or related discipline.
Minimum Experience
- Minimum 5 - 8 years of relevant experience in semiconductor or photonics backend manufacturing, with at least 3 years in a leadership role.
- Experience in InP or III-V device assembly/test strongly preferred.
- Proven track record in high-mix, low-to-medium volume environments.
- Familiarity with laser backend assembly processes (Wafer to die singulation, die attach, wire bonding, optical alignment, burn-in).
Specific Knowledge / Skills
- Strong leadership and team development skills.
- Proficiency in Lean Manufacturing, Six Sigma, SPC, and continuous improvement tools will be considered a strong plus.
- Good understanding of yield analysis, failure mechanisms, and reliability testing.
- Strong project management, analytical, and problem-solving abilities.
- Excellent communication and cross-functional collaboration skills.