Lead Research Engineer (Multi Chiplet Heterogeneous Integration and High-Speed IO Designer), (S[...]

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 75,000 - 95,000; Full time

Job summary

A leading research entity in Singapore is seeking a skilled multi-physics modelling and Process Design Kit (PDK) development engineer. The role involves collaborating across disciplines to develop advanced packaging models and frameworks. Ideal candidates will have extensive experience in PDKs, programming skills in languages like Python and C/C++, and a strong background in advanced packaging technologies. This position offers opportunity for innovation in a fast-paced environment.

Qualifications

• 5+ years of relevant experience in Process Design Kits (PDK).
• Experience with multi-physics modelling approaches.
• Strong programming and scripting skills.

Responsibilities

• Collaborate with cross-functional teams on packaging design.
• Develop accurate PDK components using advanced methods.
• Conduct Design of Experiments with measured data.

Skills

Understanding of advanced packaging

Programming skills in Python

Signal/power integrity knowledge

AI/ML algorithm development

Cross-functional collaboration

Education

Bachelor's or Master's degree

Tools

Python

C/C++

Perl

Job description

We are seeking a highly skilled multi-physics modelling and Process Design Kit (PDK) development engineer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), will focus on converting 2.5D/3D/3.5D chiplet based System in Package design and integration needs into advanced packaging PDK interconnect models, advanced co-simulation frameworks and reference flows. The successful candidate will play a crucial role in developing accelerating simulation, analysis and modelling towards design enablement of state‑of‑the‑art advanced packaging.

Key Responsibilities

• Collaborate with cross‑functional (Electrical, Thermal and Mechanical) package design and analysis teams to ensure solid understanding of the analysis parameters, input / outputs and modelling requirements.
• Evaluate and develop accurate PDK components using classical methods, multi-physics methods such as reduced order models, and probabilistic methods using applicable AI/ML algorithms or PINN.
• Participate and perform benchmark and Design of Experiments using measured tapeout data from test package of 2.5D Interposer, 3D Hybrid Bonding or 3.5D packages.
• Investigate and expand use of AI / ML algorithms within the advanced package design flow. Perform comprehensive literature survey on diffusion models, reinforcement learning, PINN, language models and identify areas of applicability for advanced packaging electrical physical design, thermal integrity and mechanical reliability analysis.
• Develop and maintain PDK including installation, Design Rule Manual, automation and reference flows.

Required Qualifications

• Bachelors or Masters with 5 years, relevant experience in handling various aspects of Process Design Kits (PDK)
• Understanding of advanced packaging / high speed or RF interconnects / I‑O PHY, signal/power integrity, thermal flow, package stress and yield in advanced packaging.
• Experience in any multi-physics modelling approaches, machine learning regression, use of language models, reduced order models.
• Programming and scripting skills in one or more of the following: SKILL, ADL, Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications

• Ability to research, develop and implement AI/ML algorithms using industry‑standard open‑source tools/methodologies.
• Strong problem‑solving aptitude and creative thinking to address technical challenges across multiple domains.
• Excellent communication and teamwork skills, with the ability to collaborate effectively in a dynamic environment.