Junior / Senior PCB Layout Engineer

LITE-ON SINGAPORE PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

LITEON SINGAPORE PTE. LTD. seeks a talented PCB Layout Engineer to join the Cloud Infrastructure Platform and Solutions Research Team in Singapore.

You will lead layouts for high-current, high-speed PCBs, and drive design for manufacturability while ensuring EMI/EMC compliance. Collaborating with electrical, mechanical and thermal teams, you will push innovations in power management and data center technology, mentor peers, and interact with fabrication partners to deliver robust prototypes and

Qualifications

• Degree in Electrical/Electronic Engineering or related field.
• 3+ years of PCB layout experience.
• Experience leading layouts for complex multilayer PCBs.
• Expert knowledge of PCB design tools: OrCad, PADS, Altium or Cadence Allegro.
• Strong power routing, high-voltage design and EMC principles.
• Knowledge of GaN/SiC, liquid cooling is a plus.
• Excellent analytical and communication skills.

Responsibilities

• Lead PCB layout activities from concepts to production-ready designs.
• Own board stack-up, component placement, routing and optimisation.
• Develop PCB design processes for high voltage/power designs.
• Drive SI/PI, EMI/EMC, thermal design and DFM.
• Collaborate with mechanical/thermal teams for cooling solutions.
• Interface with PCB fabricators and assembly partners.
• Provide design reviews and technical leadership.
• Learn and improve company layout methodologies and tools.
• Support design for safety, compliance and reliability.

Education

Degree in Electrical/Electronic Engineering or related field

Tools

OrCad

PADS

Altium Designer

Cadence Allegro

Job description

About Us

LITEON is a world-leading provider of optoelectronic semiconductor components and power management modules. At LITEON we put people at the core - LITEON has built a culture of trust and empowerment that enhances employee involvement, engagement, and commitment to excellence.

About the Role

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focused on developing future technology systems to support growth in the rapidly evolving data center sector. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities

• Lead PCBA layout activities from board concepts and lab demonstrations to product intent designs.
• Own board stack-up strategy, component placement, routing and optimisation for high-current and high-speed.
• Develop PCB design processes for high voltage/power designs, adhering to compliance and safety requirements.
• Drive best practice in signal/power integrity, EMI/EMC, thermals, design for manufacture and design for test.
• Work closely with electrical engineers to optimise design performance and product integration.
• Collaborate with mechanical/thermal teams to integrate liquid cooling, heatsinks, busbars and connectors.
• Perform design reviews and provide technical leadership across multiple projects.
• Interface with PCB fabricators and assembly partners to deliver optimised and cost-effective prototypes.
• Learn, implement and improve companywide layout methodologies, tools and practices.
• Support design for safety, compliance and reliability.
• Continuously research PCBA technologies for lab demonstrations and product integration.

Requirements

• Degree in Electrical/Electronic Engineering or related field.
• 3+ years of PCB layout experience.
• Experience leading layouts for complex multilayer PCBs, owning review processes.
• Expert knowledge of PCB design tools such as OrCad, PADS, Altium Designer or Cadence Allegro.
• Strong understanding of high-current power routing, creepage and clearance, high-voltage design, differential pair routing, controlled impedance, high speed interfaces, EMC design principles, thermal optimisation and design for manufacturability.
• Experience working with power electronics(AC/DC, DC,DC, etc) and controllers (FPGAs, DSPs, MCUs, etc).
• Desirable experience: working with power modules, GaN and SiC, liquid cooled electronics and HDI technologies.
• Strong analytical, problem-solving, and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.
• We welcome applicants at all experience levels, from recent graduates to seasoned professionals.

Why Join Us

• World-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture