Head of TCB Process Engineering — Bonding Innovation & Equity

Pyxis CF; Singapore; On-site; SGD 125,000 - 150,000; Full time

Job summary

A semiconductor packaging technology firm based in Singapore is seeking a Head of Process Engineering. The role involves leading the development and qualification of bonding processes for advanced semiconductor packaging. Candidates should have over 8 years of experience in TCB or Hybrid Bonding, strong leadership skills, and a relevant degree. Competitive compensation includes bonuses and equity participation.

Benefits

Performance bonus

Participation in equity program

Qualifications

• 8+ years in advanced semiconductor packaging or wafer-level bonding process development.
• Demonstrated expertise in Thermo-Compression Bonding or Hybrid Bonding.
• Strong understanding of thermal-mechanical interaction and yield optimization.

Responsibilities

• Lead process development for flux-less Thermo-Compression Bonding.
• Define critical-to-quality parameters and Design Validation Plan & Report.
• Establish and maintain bonding environment and process standards.
• Develop and own process FMEA, SPC, and predictive maintenance metrics.
• Interface with customers and partners for process qualification.

Skills

Thermo-Compression Bonding (TCB)

Process Development

Yield Optimization

Cross-site Process Alignment

Analytical Skills

Education

Bachelor’s or Master’s Degree in Mechanical, Materials, Mechatronics, or Semiconductor Process Engineering

Tools

Intel TCB tools

TSMC TCB tools

ASMPT TCB tools

Hanmi TCB tools

Job description

A semiconductor packaging technology firm based in Singapore is seeking a Head of Process Engineering. The role involves leading the development and qualification of bonding processes for advanced semiconductor packaging. Candidates should have over 8 years of experience in TCB or Hybrid Bonding, strong leadership skills, and a relevant degree. Competitive compensation includes bonuses and equity participation.