Head of Process Engineering – Thermo-Compression Bonder Systems

Pyxis CF Pte Ltd; Singapore; On-site; SGD 125,000 - 150,000; Full time

Job summary

A leading semiconductor technology firm in Singapore is seeking a Head of Process Engineering to lead the development and qualification of next-generation thermo-compression bonding processes. The ideal candidate will have over 8 years of experience in semiconductor packaging, with a strong background in thermo-compression bonding and yield optimization. This role offers a competitive compensation package, including performance bonuses and equity program participation.

Benefits

Competitive senior-engineering package

Performance bonus

Participation in equity program

Qualifications

• 8+ years in advanced semiconductor packaging or wafer-level bonding process development.
• Demonstrated expertise in Thermo-Compression Bonding or Hybrid Bonding.
• Strong understanding of thermal-mechanical interaction and yield optimization.

Responsibilities

• Lead process development for flux-less Thermo-Compression Bonding.
• Define critical-to-quality parameters and Design Validation Plan & Report frameworks.
• Establish and maintain bonding environment standards.

Skills

Thermo-Compression Bonding

Yield optimization

Process development

Analytical skills

Communication skills in English

Education

Bachelor’s or Master’s Degree in Mechanical, Materials, Mechatronics, or Semiconductor Process Engineering

Tools

Intel / TSMC / ASM-PT / Hanmi TCB tools

Job description

About PYXIS CF

PYXIS CF Pte Ltd is a Singapore-based developer of next‑generation Thermo‑Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our technical leadership team to accelerate the Alpha build of our HBM‑class TCB platform targeted for 2026.

Position Overview

The Head of Process Engineering will lead the definition, development, and qualification of next‑generation TCB bonding processes and their translation into equipment capability requirements.
The role requires deep hands‑on experience in flux‑less thermal compression bonding, formic‑acid/N₂ environments, and precision die‑to‑substrate assembly at fine pitch (< 50 µm).
This position reports directly to the CEO and will collaborate closely with the Head of Equipment Engineering and software control teams.

Key Responsibilities

• Lead process development for flux‑less Thermo‑Compression Bonding (TCB) for advanced packaging (HBM, CoWoS, 2.5D/3D).
• Define critical‑to‑quality (CTQ) parameters and Design Validation Plan & Report (DVP&R) frameworks for bonding yield, die tilt, and warpage control.
• Establish and maintain formic‑acid bonding environment and N₂ tunnel process standards.
• Correlate process responses with equipment parameters (Z‑axis control, force‑temperature loops, heater uniformity, clamping pressure).
• Develop and own process FMEA, SPC, and predictive maintenance metrics.
• Interface with customers and partners (e.g. Micron Singapore, regional OSATs) for process qualification and yield improvement.
• Coach and build a local team of process and integration engineers; drive knowledge transfer and documentation.
• Collaborate with mechanical, control, and software groups to ensure process requirements are translated into tool specifications.
• Contribute to patent generation and technical papers on bonding process innovation.

Requirements

• Bachelor’s or Master’s Degree in Mechanical, Materials, Mechatronics, or Semiconductor Process Engineering.
• 8+ years in advanced semiconductor packaging or wafer‑level bonding process development.
• Demonstrated expertise in Thermo‑Compression Bonding (TCB) or Hybrid Bonding (Cu‑Cu / micro‑bump ≤ 50 µm pitch).
• Strong understanding of thermal‑mechanical interaction, formic‑acid environment, and yield optimization.
• Experience leading cross‑site process alignment, FMEA, and equipment qualification.
• Excellent analytical, documentation, and communication skills in English.

Preferred / Advantageous

• Experience with Intel / TSMC / ASM‑PT / Hanmi TCB tools or similar.
• Knowledge of AI‑based predictive control, vibration isolation, or signal‑driven maintenance systems.
• Proven record of mentoring engineers and managing technology transfer projects.

Location

Singapore – PYXIS CF R&D Centre (Cleanroom & Lab Facility)

Compensation

Competitive senior‑engineering package commensurate with experience, including performance bonus and participation in the company’s equity program.