Front End Central Product Integration - Chip Interaction Senior Engineer/Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A global semiconductor leader in Singapore is seeking a Front End Central Product Integration Engineer to drive yield and quality improvements for silicon node packaging. The role requires a Bachelor’s or Master's degree in a relevant field and at least 2 years of experience in semiconductor processing. Key responsibilities include leading project teams, defining integration strategies, and maintaining technical expertise. This position involves some travel (20–50%) for collaboration at various fab locations.

Qualifications

• Minimum of 2 years of experience in BEOL semiconductor processing or process integration.
• Knowledge in Semiconductor Device Physics and wafer fabrication process flows.
• Demonstrated teamwork skills with focus on developing good team dynamics.

Responsibilities

• Promote worldwide synergy for improved benchmark performance through global project management.
• Define strategies for Packaging Technology qualification ahead of product qualification.
• Lead teams to address yield and quality challenges timely.

Skills

Data analysis

Troubleshooting

Presentation skills

Interpersonal skills

Organizational capabilities

Communication skills

Multi-tasking

Education

Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science/Engineering or related field

Tools

Microsoft Office

Job description

As Front End Central Product Integration Engineer-Chip Package Interaction at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity.

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with FrontEnd manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science/Engineering or related field
• A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required
• Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50%
• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.
• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.
• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.
• Good multi-tasking, verbal, and written communication skills.
• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
• Good organizational capabilities and ability to work effectively with minimal supervision.
• Intermediate to advanced PC skills including Microsoft Office.
• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.