Etching Process Engineer - Wet/Dry, TSVs, Yield

United Microelectronics Corporation (Singapore Branch); Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

United Microelectronics Corporation (Singapore Branch) is seeking a Process Engineer to advance semiconductor processes through experimental design and development to achieve more stable processes, lower costs, and higher yields.

You will collaborate with manufacturers and engineers to develop strategies and solutions that improve efficiency, manage cross-functional projects, and lead process improvement initiatives.

Qualifications

• Bachelor's degree in a relevant engineering or physics field.
• At least 2 years of semiconductor foundry process experience.
• Experience with 22/28 nm nodes is highly desirable.
• Strong understanding of process development, optimization and troubleshooting.

Responsibilities

• Develop and optimize wet etch, cleaning, and tape removal processes.
• Develop and optimize dry etch processes for TSVs and bonding related layers.
• Develop and improve metrology methods and measurement processes.

Skills

Semiconductor process

Process development

Troubleshooting

Project leadership

Cross-functional teamwork

DOE/FMEA

Education

Engineering or Physics degree

Tools

DOE/8D tools

FMEA methods

Job description

United Microelectronics Corporation (Singapore Branch) is seeking a Process Engineer to advance semiconductor processes through experimental design and development to achieve more stable processes, lower costs, and higher yields.

You will collaborate with manufacturers and engineers to develop strategies and solutions that improve efficiency, manage cross-functional projects, and lead process improvement initiatives.