[Entry] Process Technician (Up$3.5K/ Night shift, 4 Days)

ADECCO PERSONNEL PTE LTD; Singapore; On-site; SGD 20,000 - 60,000; Full time

Job summary

A government-affiliated science agency in Singapore is seeking a technician to operate and monitor semiconductor equipment. Candidates should have a Nitec/Higher Nitec in Engineering, Electronics, or Mechatronics and must be comfortable with night shifts. The role involves process error recovery, documentation, and equipment handling in a cleanroom environment. A competitive salary of up to $3,500 is offered based on experience.

Benefits

Training provided

Basic Salary up to $3,500

Qualifications

• Strong interest in hands-on technical work and learning from the ground up.
• Must be comfortable with night shift operations.

Responsibilities

• Operate and monitor semiconductor equipment and recover process errors.
• Execute process sequences and document tool parameters and die-level data.
• Transport wafer lots within cleanroom environments.
• Identify areas for improvement in cycle time, utilization, and cost.
• Specialize in flip chip bonding processes including solder bump formation, die alignment, bonding, underfill, and inspection.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.

Skills

Machine calibration

Die bonding

Tool recovery

Accurate documentation

Adaptability

Troubleshooting

Education

Nitec/Higher Nitec in Engineering, Electronics, Mechatronics or related fields

Job description

The Opportunity

Our client, Government-affiliated Science Agency

• Working Location: One-North Area
• Basic Salary: Up to $3,500 (commensurate with experience)
• Working hours: 4334, 9PM-9AM (With allowance)
• Training provided (Training on normal shift)
• 1 year contract (Subjected to renewal/conversion)

Job Responsibilities

• Operate and monitor semiconductor equipment and recover process errors.
• Execute process sequences and document tool parameters and die-level data.
• Transport wafer lots within cleanroom environments.
• Identify areas for improvement in cycle time, utilization, and cost.
• Specialize in flip chip bonding processes including solder bump formation, die alignment, bonding, underfill, and inspection.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.

Job Requirements

• Nitec/Higher Nitec in Engineering, Electronics, Mechatronics or related fields.
• Strong interest in hands-on technical work and learning from the ground up.
• Hard Skills: Machine calibration, die bonding, tool recovery.
• Soft Skills: Accurate documentation, adaptability, troubleshooting.
• Must be comfortable with night shift operations.

Next Step

• Prepare your updated resume (please include your current salary package with full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Simply click on 'Apply here' to drop your resume.
• All shortlisted candidates will be contacted.

Jason Ng
Direct Line: 6697 7967
EA License No: 91C2918
Personnel Registration Number: R23113333