Entry-Level Wire Bonding Technician – Semiconductors

RecruitFirst Pte. Ltd; Singapore; On-site; SGD 36,000 - 48,000; Full time

Benefits offered by this job

Shift allowances

Bonuses

Job summary

RecruitFirst Pte Ltd in Singapore is seeking an entry level Assembly Technician to support wire bonder machines at Serangoon North. The role involves assembling and testing equipment, collecting data, and performing self-verification against specifications.

Applicants should have a Nitec or higher in Engineering/Electronics and be available on short notice. The position offers 12 months tenure or possibility of permanency, with shifts that include day, noon, or night options.

Qualifications

• Minimum Nitec and above in Engineering / Electronics related field with related experience.
• Available on short notice will be an added advantage.

Responsibilities

• Assemble and test wire bonder machines to meet technical specification.
• Gather measurement data independently and perform self verification.
• Perform semi complex troubleshooting, debugging, and repair based on established troubleshooting guides.

Skills

Data collection & analysis

Troubleshooting

Wire bonder operation

Education

Nitec or above in Engineering/Electronics

Job description

RecruitFirst Pte Ltd in Singapore is seeking an entry level Assembly Technician to support wire bonder machines at Serangoon North. The role involves assembling and testing equipment, collecting data, and performing self-verification against specifications.

Applicants should have a Nitec or higher in Engineering/Electronics and be available on short notice. The position offers 12 months tenure or possibility of permanency, with shifts that include day, noon, or night options.