Engineering Execution Manager, HIG High Bandwidth Memory (HBM) Singapore, Singapore Posted 10 hours ago

Micron Technology, Inc

Singapore

On-site

SGD 140,000 - 200,000

Full time

14 days+
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Benefits offered by this job

Medical, dental and vision plans
Paid time-off
Paid holidays

Job summary

Micron Technology, Inc. is seeking an Engineering Execution Manager for HBM in the HIG organization to drive end-to-end product development from concept to HVM.

You will lead cross-functional teams across PMO, design, process, and manufacturing, owning development schedules and mitigating risks to meet milestones. You will communicate status to senior leadership, set tactical expectations, and ensure hardware readiness through detailed planning and documentation.

Qualifications

  • Bachelor's or Master's degree in Electrical or Computer Engineering or manufacturing/supply chain related fields.
  • 5+ years of relevant technical, manufacturing or experience in driving cross functional teams.
  • Excellent Communication/Presentation skills.
  • Excellent written and verbal communication skills for technical and senior management audiences.
  • Comfortable with data analysis methods and data visualization; communicating data-backed conclusions.
  • Familiarity and capability with JIRA, Confluence, Project Management software tools.
  • Having an innovative mindset which is open to improve upon any process or product.

Responsibilities

  • Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations.
  • Partner with the Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment.
  • Collaborate with PMO org to build and maintain detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM.
  • Provide regular communication of development status, priorities, and challenges across the broader organization.
  • Set and prioritize tactical expectations across development activities, according to defined milestones and stakeholder needs and expectations.
  • Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and managing development documentation.
  • Consolidate and provide the inputs for hardware readiness and capacity planning required to support engineering activities.

Skills

Cross-functional teamwork
Data analysis & visualization
Strong communication
Presentation skills

Education

Bachelor's or Master's degree in Electrical or Computer Engineering or manufacturing/supply chain related fields

Tools

JIRA
Confluence
Project Management software

Job description

JR111137 Engineering Execution Manager, HIG High Bandwidth Memory (HBM) (Evergreen)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison.

As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and deliverables.

Key Responsibilities
  • Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations.
  • Partner with the Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment.
  • Collaborate with PMO org to build and maintain detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM.
  • Provide regular communication of development status, priorities, and challenges across the broader organization.
  • Set and prioritize tactical expectations across development activities, according to defined milestones and stakeholder needs and expectations.
  • Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and managing development documentation.
  • Consolidate and provide the inputs for hardware readiness and capacity planning required to support engineering activities.
Key Requirements
  • Bachelor's or Master's degree in Electrical or Computer Engineering or manufacturing/supply chain related fields.
  • 5+ years of relevant technical, manufacturing or experience in driving cross functional teams.
  • Excellent Communication/Presentation skills.
  • Excellent written and verbal communication skills for technical and senior management audiences.
  • Comfortable with data analysis methods and data visualization; communicating data-backed conclusions.
  • Familiarity and capability with JIRA, Confluence, Project Management software tools.
  • Having an innovative mindset which is open to improve upon any process or product.
Job Profile(s)

Product Development Engineer 4 - Product Development Engineer 5

Relocation level: (TBD)

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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