Engineering Director, Wafer Packaging & Process Excellence

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 125,000 - 150,000; Full time

Job summary

A leading semiconductor packaging company in Singapore seeks a Senior Engineering Manager. The ideal candidate will have a degree in Electrical, Electronics, Mechanical, or Chemical Engineering and a minimum of 15 years of engineering experience in wafer fabrication or bumping, including 5 years in a management role. Responsibilities include driving manufacturing processes, engaging with cross-functional teams, and ensuring customer satisfaction. A commitment to continuous improvement in quality and cost is essential.

Qualifications

• Minimum of 15 years engineering experience in wafer fab or wafer bumping house.
• At least 5 years of management experience at Director/Deputy Director level.
• Thorough knowledge of wafer level packaging, engineering, and production.

Responsibilities

• Understand customer requirements and meet/exceed customer goals.
• Drive team to set up stable manufacturing processes.
• Deploy FDC and SPC on key equipment.

Skills

Engineering management

Statistical Process Control

Continuous improvement

Cross-functional collaboration

Education

Degree in Engineering (Electrical/Electronics/Mechanical/Chemical)

Job description

A leading semiconductor packaging company in Singapore seeks a Senior Engineering Manager. The ideal candidate will have a degree in Electrical, Electronics, Mechanical, or Chemical Engineering and a minimum of 15 years of engineering experience in wafer fabrication or bumping, including 5 years in a management role. Responsibilities include driving manufacturing processes, engaging with cross-functional teams, and ensuring customer satisfaction. A commitment to continuous improvement in quality and cost is essential.