Engineer, HIG HBM

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 140,000 - 200,000; Full time

Job summary

Micron Technology, Inc. is seeking a senior reliability engineering leader in Singapore to spearhead a high-performing team focused on reliability test development for the latest HBM products.

You will drive reliability improvements, collaborate with Fab, TD, GQ, and Quality teams, and mentor team members to meet KPI goals in Quality, Cost, and Cycle Time. The role emphasizes ownership of qualification plans, cross-functional collaboration, and AI-enabled reliability workflows to maintain a

Qualifications

• Bachelor's or Master's degree in Electrical and Electronics Engineering or related field.
• Experience in semiconductor devices, circuit design, or product validation is a plus.
• Exposure to data analysis and scripting tools.

Responsibilities

• Define and develop reliability stress, test flows and plans for product reliability aspects.
• Define qualification plan, oversee execution and gate issues.
• Drive extrinsic and intrinsic reliability improvements with optimized test flows and strategies.
• Debug and identify root cause for Qual and RMA device issues and drive improvements.
• Provide recommendations for process conversions to reduce cost and increase yields.
• Collaborate with Fab, TD, GQ and Quality teams to meet objectives.
• Mentor and develop others, manage projects and drive AI-enabled reliability workflows.

Skills

CMOS tech

DRAM architecture

Data analysis

Root cause analysis

Python or scripting

Team collaboration

Problem solving

Communication

Education

BSc/MSc in Electrical & Electronics Engineering

Tools

Python

JMP

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.
• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time.
• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields.
• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions.
• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition.
• Mentorship and Development of Others: The role involves actively developing and mentoring others.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization.
• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team.
• AI-First Mindset & Mentorship: Actively engage and leverage Artificial Intelligence; embed AI/automation into reliability workflows as a standard practice, aligned with Micron’s AI-first productivity direction.

Requirements

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
• Experience in semiconductor devices, circuit design, or product validation is a plus.
• Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
• Strong attention to detail and a commitment to quality.
• Ability to work effectively in team-based projects, contributing to shared goals and outcomes.
• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.
• Responsible and accountable, with a professional work ethic and ownership of assigned tasks.
• Clear and effective communication skills, especially when articulating technical concepts and findings.

About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail] Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.