DMTS, Advanced Packaging Integration Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

A global semiconductor leader in Singapore is hiring a Distinguished Member of Technical Staff (DMTS) Process Integration Engineer. In this role, you'll develop advanced packaging technologies and coordinate the transition from product development to production. The ideal candidate will have over 10 years of semiconductor experience and proficiency in Python and data analytics. Join us to innovate and implement next-generation packaging solutions in a collaborative environment.

Qualifications

• 10+ years of semiconductor process integration experience.
• 3+ years of experience as a DMTS in semiconducting.
• Experience with process modeling and data analytics.

Responsibilities

• Develop advanced packaging technologies that deliver cost-effective solutions.
• Ensure smooth transition from product development to production.
• Monitor industry trends and define future roadmaps for packaging technologies.

Skills

Proficiency in Python

Proficiency in R

Proficiency in SQL

Strong data analytics capabilities

Ability to resolve complex issues

Education

B.S/M.S./Ph.D. in relevant fields

Tools

E3

FDC

RMS

Visual Basic

Job description

As a Distinguished Member of Technical Staff (DMTS) Process Integration Engineer within APTD, you will lead initiatives that develop and enable innovative packaging solutions. These solutions support new and emerging integration projects. Your work will ensure that products leveraging these technologies meet performance, cost, manufacturability, quality, reliability, and schedule requirements. This role requires close collaboration with peers, internal partners, and external suppliers to coordinate development and successful deployment of next‑generation packaging solutions.

Key Responsibilities

Technology Development & Integration

Develop and enable advanced packaging technologies that deliver cost‑effective solutions with predictable reliability.

Collaborate with peers to establish project timelines and verify work needed to meet objectives.

Partner with internal teams and external suppliers to develop new capabilities required for advanced packaging solutions.

Product Transition & Qualification

Ensure smooth transition from new product development and qualification to small‑volume and high‑volume production.

Provide proper Plan of Record (POR) documentation for product transfer to manufacturing.

Work with internal teams to support new product and technology transfers.

Future Capability Planning

Anticipate packaging needs and develop capabilities ahead of demand.

Monitor industry trends and define future roadmaps for packaging technologies.

Collaborate with peers and internal teams to implement new capabilities aligned with strategic goals.

Management & Communication

Identify areas for improvement and propose systematic solutions.

Adapt communication style to engage and motivate teams effectively.

Fulfill formal communication and coordination responsibilities across work units.

Maintain frequent communication with peers and team members under your guidance.

Continuously develop knowledge and skills to meet organizational needs.

Safety & Compliance

Promote and enforce safe, compliant behavior through regular communication and performance management.

Review and respond to reports from supervisory staff, EHSS teams, and auditors.

Conduct work area inspections and operational observations.

Maintain area procedures and training to ensure legal compliance and adherence to management systems.

Requirements

B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields

10+ years of semiconductor process integration experience, preferably with know‑how to develop and enable advanced package technology for post‑fab wafer finish and assembly processes

3+ years of experience as a DMTS (Distinguished/Distinguished Member of Technical Staff) in semiconducting.

Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.

Experience with Visual Basic for automation and tool integration.

Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.

Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team

Ability to resolve complex issues through root‑cause or model‑based problem solving

Tenacity to work effectively under timelines and limited resources

Consistent track record to solve problems and address root causes