Director Program Manager – Advanced Packaging & Technology Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Director of Program Management to lead strategic initiatives in Advanced Packaging & Technology Development. The ideal candidate will have over 8 years of experience in semiconductor packaging and a proven track record of managing complex programs. This role is crucial for driving operational excellence and enhancing collaboration across various departments.

Qualifications

• 8+ years of experience in semiconductor packaging or technology development.
• Proven record leading complex, cross-functional programs in a high-tech environment.
• Solid understanding of advanced packaging flows (e.g., hybrid bonding, CoWoS).

Responsibilities

• Lead all aspects of the full lifecycle of APTD programs.
• Develop and implement standardized PMO methodologies and tools.
• Align program goals with APTD’s charter.

Skills

Leadership

Stakeholder management

Communication

Cross-functional collaboration

Education

Bachelor’s or Master’s degree in Engineering or Materials Science

Job description

Role Summary

The Director, Program Management – Advanced Packaging & Technology Development (APTD) will lead strategic initiatives across the APTD organization, driving operational excellence and ensuring alignment with APTD’s mission to accelerate yield maturity, technology transfer, and future packaging innovations. This role establishes governance frameworks, oversees program execution, and develops cross-functional collaboration to deliver high-impact results.

Key Responsibilities

Program & Project Leadership

• Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure.
• Define program objectives, deliverables, resource plans, and success metrics.
• Lead cross-functional teams across PDE, CPI, DRAM, and NPI to ensure timely, high-quality delivery of critical initiatives.

Governance & Operational Excellence

• Develop and implement standardized PMO methodologies, tools, and templates.
• Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems.
• Ensure compliance with internal governance standards and external customer requirements.

Strategic Alignment & Communication

• Align program goals with APTD’s charter to embed analytics and simulation into development workflows.
• Drive team member engagement across BU, PDT, TPM, and central engineering teams.
• Provide leadership with regular updates on program status, risks, and mitigation strategies.

Performance & Accountability

• Define and track critical metrics for program success, yield reporting, and EOL accountability.
• Conduct program reviews to assess outcomes and bring together lessons learned.
• Mentor project managers and foster continuous improvement across PMO practices.

Qualifications

• Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field.
• 8+ years of experience in semiconductor packaging, process integration, or technology development.
• Proven record leading complex, cross-functional programs in a high-tech environment.
• Solid understanding of advanced packaging flows (e.g., hybrid bonding, CoWoS, chiplet integration).
• Outstanding communication, leadership, and stakeholder management skills.
• Experience with IIoT hardware deployment and APC systems.
• Familiarity with frameworks such as PDE, CPI, and NPI.
• Knowledge of simulation modeling, yield improvement, and defectivity analysis.