Director, Advanced Packaging Disruptive Technology

Applied Materials South East Asia Pte Ltd

Singapore

On-site

SGD 300,000 - 600,000

Full time

14 days+

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Job summary

Applied Materials South East Asia Pte Ltd seeks a Director to define and drive long-range pathfinding and disruptive packaging technology strategy. You will lead a high-impact team focused on exploratory pre-product tech such as D2W, RDL, CoWoS, TSV, and connect inflections to customer roadmaps.

You will interface with customers and ecosystems to translate market needs into differentiated technology programs, nurturing partnerships and governance to scale innovations.

Qualifications

15+ years of experience in semiconductor technology, including advanced packaging or adjacent domains.
Proven leadership of cross-functional or exploratory R&D teams.
Ability to translate complex tech concepts into business impact and strategy.
Track record delivering disruptive or first-of-a-kind technology solutions.

Responsibilities

Define and execute long-range pathfinding roadmap for advanced packaging (N+2 and beyond).
Incubate feasibility studies for disruptive packaging approaches beyond current platforms.
Evaluate options and guide make/buy/partner decisions to stay ahead of industry adoption cycles.
Translate customer roadmaps and market inflections into actionable development strategies.

Skills

Leadership

Advanced packaging

Strategy

Team building

Industry networks

Education

PhD/MS in related field

Job description

Role Overview

This role is responsible for defining and driving pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities. The Director will build and lead a high-impact team focused on exploratory, pre-product technologies, developing solutions such as D2W, RDL, CoWoS, TSV, etc and connecting emerging technology inflections to customer and market roadmaps.

This position operates at the intersection of technology disruption, customer insight, and ecosystem co-innovation, with a mandate to translate early-stage innovation into scalable, differentiated solutions.

Disruptive Pathfinding & Technology Strategy

Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.
Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).
Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.
Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.

Innovation Leadership & Team Building

Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.
Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.
Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.
Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.

Customer & Market-Driven Innovation

Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.
Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.
Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.
Position offerings to create clear value differentiation and long-term competitive advantage.

Ecosystem Development & Strategic Partnerships

Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.
Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.
Drive joint development programs and consortia engagement to shape industry direction and standards.

Program Leadership & Execution Governance

Establish governance models for early-stage technology programs, balancing exploration with execution discipline.
Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.
Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.
Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.

Leadership Expectations

Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.
Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.
Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.
Builder of Teams & Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.
Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.

Core Qualifications

15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.
Proven experience building and leading cross-functional or exploratory R&D teams.
Ability to translate complex technology concepts into business impact and strategic direction.

Preferred Qualifications

Advanced degree (PhD/MS) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field.
Track record of delivering disruptive or first-of-a-kind technology solutions.
Experience in heterogeneous integration, chiplet ecosystems, or next-generation packaging architectures.
Strong network across industry ecosystem and research communities.

Impact

Shape the company’s long-term innovation trajectory in advanced packaging.
Enable next-generation technology breakthroughs aligned with future system demands.
Drive value creation through differentiated solutions and early market positioning.

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