Dicing Process Engineer

Heptagon Photonics Pte Ltd.; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

A leading semiconductor and photonics company in Singapore is seeking a Dicing Process Engineer. The role involves developing robust dicing processes for advanced wafer singulation and driving innovation in wafer-level processing. Candidates must have at least 5 years of experience in the semiconductor or photonics industries and a strong educational background in relevant engineering fields. This position is essential for delivering cutting-edge microfabrication solutions.

Qualifications

• Minimum 5 years of hands-on experience in wafer dicing process development.
• Proven track record of developing and scaling dicing processes.
• Deep understanding of wafer materials and mechanical properties.

Responsibilities

• Drive innovation in wafer-level processing and support new product introductions.
• Ensure manufacturing excellence through continuous process improvement.

Skills

Problem-solving

Communication skills

Team spirit

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field

Tools

IE

SPC

PFMEA

CP

MSA

NPI

Job description

Job Description

The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon substrates. The engineer will drive innovation in wafer-level processing, support new product introductions, and ensure manufacturing excellence through continuous process improvement.

Job Requirement

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field.
• Minimum 5 years of hands‑on experience in wafer dicing process development, preferably in semiconductor or photonics industries.
• Proven track record of developing and scaling dicing processes for glass and silicon wafers.
• Deep understanding of wafer materials, mechanical properties, and dicing‑induced stress.
• Proficient in common tools such as IE, SPC, PFMEA, CP, MSA, and NPI.
• Familiarity with Cleanroom practices and wafer handling protocols.
• Strong Problem‑solving and communication skills.
• Strong Team spirit, sense of responsibility, result‑oriented mindset and practical work ethics.