CMP Process Master / Expert

ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A semiconductor manufacturing company in Singapore seeks an experienced professional for CMP process development. The candidate will design processes for advanced substrate manufacturing, monitor tool performance, and collaborate with cross-functional teams. A PhD or Master's in a relevant field with 5-10+ years of experience is required. Ideal candidates should possess strong analytical and problem-solving abilities, and hands-on CMP tool experience.

Qualifications

• 5–10+ years of experience in CMP process development in semiconductor packaging.
• Hands-on experience with CMP tools.
• Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up.

Responsibilities

• Develop and refine CMP processes for planarizing dielectric and metal layers.
• Monitor and maintain CMP tool performance.
• Investigate and resolve CMP-related defects.
• Collaborate with upstream and downstream process owners.
• Perform statistical analysis to identify critical process parameters.

Skills

CMP process development

Defect analysis

Analytical skills

Problem-solving skills

Collaboration

Education

PhD or Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering

Tools

CMP tools

Job description

Job Responsibilities

Process Development & Optimization

• Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing.
• Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.

Equipment & Tooling Support

• Define equipment specifications and validate CMP tools.
• Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.

Yield & Quality Improvement

• Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
• Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.

Process Integration

• Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
• Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies.

Data Analysis & Documentation

• Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
• Document standard operating procedures (SOPs), work instructions, and control plans.

Cross-Functional Collaboration

• Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
• Assist with customer qualifications and reliability testing as needed.

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications

• PhD or Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.
• 5–10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing.
• Hands‑on experience with CMP tools.
• Solid understanding of substrate technologies such as Damascene, SAP, ABF build‑up, or Embedding.

Specialized Knowledge & Skills

• Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
• Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
• Knowledge of slurry chemistry, pad materials, and post‑CMP cleaning processes.
• Strong analytical, documentation, and problem‑solving skills.
• Good communication and teamwork in a cross‑functional environment.