CMP Process Engineer (Manager / Senior Engineer)

Reeracoen Singapore Pte Ltd; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

A leading manufacturing company in Singapore is seeking a CMP Process Engineer to join their team. The role involves developing CMP processes, optimizing polishing recipes, and collaborating with cross-functional teams to support advanced substrate manufacturing. This is an exciting opportunity to contribute significantly to a new factory setup.

Responsibilities

• Develop and refine CMP processes for planarizing dielectric and metal layers.
• Optimize polishing recipes and process parameters to achieve planarity.
• Monitor and maintain CMP tool performance.
• Investigate and resolve CMP-related defects.
• Collaborate with process owners for seamless integration.
• Perform statistical analysis to control critical process parameters.
• Document standard operating procedures and work instructions.
• Work with cross-functional teams to support process scale-up.

Job description

Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing.

Reports to: R&D Manager

Responsibilities

1. Process Development & Optimization
   • Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric) in advanced substrate manufacturing.
   • Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.
2. Equipment & Tooling Support
   • Define equipment specifications and validate CMP tools.
   • Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.
3. Yield & Quality Improvement
   • Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
   • Implement process monitoring techniques such as thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.
4. Process Integration
   • Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
   • Support the development of process flows for advanced packaging substrates, including SAP/Damascene and ABF/PI/PID-based technologies.
5. Data Analysis & Documentation
   • Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
   • Document standard operating procedures (SOPs), work instructions, and control plans.
6. Cross-Functional Collaboration
   • Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
   • Assist with customer qualifications and reliability testing as needed.