Business Development Manager / Director

STATS ChipPAC Pte. Ltd. (Corporate Office); Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

A leading advanced packaging solutions provider in Singapore is seeking a professional to drive customer development and demand identification in HPC and AI sectors. This role involves market analysis, solution alignment, and collaboration with internal teams to deliver innovative packaging solutions. The ideal candidate holds a Bachelor’s degree, has solid technical knowledge, and excels in communication. Competitive compensation and expansion opportunities are offered.

Qualifications

• Strong understanding of advanced packaging technologies and their applications.
• Ability to identify customer needs and develop strategies for market expansion.
• Fluent in Chinese and English for effective communication.

Responsibilities

• Expand market for advanced packaging in HPC and AI domains.
• Conduct analysis of customer needs and align solutions.
• Research market trends and competitor strategies.

Skills

Technical comprehension

Business development

Communication and negotiation

Resource integration

Project management

Education

Bachelor degree in any discipline

Job description

Responsibilities

1. Customer Development and Demand Identification
   • Responsible for market expansion of advanced packaging business, focusing on identifying customers with needs in emerging domains such as high‑performance computing (HPC) and artificial intelligence (AI), including requirements for high‑density integration, high bandwidth, and thermal management. Special attention will be paid to HPC customers’ specific demands for large‑scale parallel computing chip packaging.
   • Establish and maintain relationships with key customers through regular visits to gain deep insights into their product roadmap, particularly regarding HPC chip iteration plans and CPO implementation plans for data center network upgrades, aiming to become a trusted technical and business partner.
2. Demand Analysis, Solution Alignment, and Capex Investment Requirement Assessment
   • Conduct in‑depth analysis of customers’ specific needs for advanced packaging, covering technical indicators, cost budgets, mass production cycles, application scenarios, etc. Evaluate HPC customers’ packaging requirements for high‑speed inter‑chip interconnection and efficient heat dissipation; for CPO requirements, understand specialized process demands for integrating optical modules with chips.
   • Leverage the company’s advanced packaging capabilities (existing processes, R&D priorities, and production capacity) to develop tailored solutions, such as recommending suitable packaging formats and providing sample testing support.
   • Serve as liaison between customers and internal technical teams, ensuring accurate transmission of customer needs to R&D and engineering departments, facilitating internal resource alignment, and ensuring the solution feasibility and competitiveness.
   • Focus on customers’ capacity needs and technical upgrade plans in long‑term partnerships, identifying potential Capex investment requirements in alignment with the company’s advanced packaging business growth objectives.
3. Market and Competitor Analysis, and Insights for Capex Investment Strategies
   • Research trends in the advanced packaging market, emphasizing technological evolution, expansion of mainstream application, and policy impacts in HPC and CPO sectors. Analyze competitors’ product portfolios, pricing strategies, customer engagement approaches, and Capex investment trends, such as their initiatives in expanding advanced packaging capacity for HPC chips and commercializing CPO packaging technologies, to inform the company’s business decisions and Capex investment strategies.
   • Collect customer feedback and industry intelligence to support the optimization of the company’s advanced packaging technology roadmap, product portfolio, pricing strategies, and Capex investment prioritization, specifically driving rational investments in relevant advanced packaging, R&D, and capacity development based on market dynamics and customer demands.
4. Internal Collaboration, Resource Coordination, and Capex Investment Execution
   • Collaborate with R&D teams to conduct market validation of new advanced packaging technologies and processes, accelerating the conversion of technical innovations into commercial products—focusing on HPC and CPO‑related advanced packaging technologies. Example initiatives include R&D validation of high‑bandwidth, low‑latency packaging for HPC chips, technical optimization of memory packaging to enhance storage density and read/write speeds, and industrialization of CPO optoelectronic co‑packaging technologies, jointly assessing Capex requirements for scaling new technologies.
   • Coordinate with finance, production, and other departments to contribute to feasibility analysis of Capex investment projects. From a business development perspective, articulate market demand drivers and customer collaboration potential to facilitate smooth project progression and execution, ensuring investments effectively support business growth in HPC and CPO advanced packaging.

Qualifications

1. Minimum Bachelor degree in any discipline.
2. Technical comprehension: Understand mainstream advanced packaging technologies (principles, processes, applications) and align customer technical needs with company capabilities.
3. Business development: Sharp market insight, proactively identify potential customers’ advanced packaging needs, and develop targeted expansion strategies.
4. Communication and negotiation: Strong Chinese‑English (listening, speaking, reading, writing); efficiently communicate with customer senior management and technical teams, convey company value, and finalize business negotiations/contracts.
5. Resource integration: Coordinate internal tech, R&D, and production teams to deliver customized advanced packaging solutions.
6. Project management: Track end‑to‑end business processes (demand docking → solution design → order delivery), ensure smooth project progress, and resolve cooperation issues.