Assistant Mfg Engineer: Wire Bonding & Process Improvement

Kinergy Corporation; Singapore; On-site; SGD 20,000 - 60,000; Full time

Job summary

A technology company based in Singapore is seeking a qualified individual for a technical role involving equipment assembly, testing, and maintenance of wire bonder equipment. Candidates must possess a degree in engineering and have at least 3 years of relevant experience in the semiconductor or manufacturing industries. Strong leadership and communication skills are essential, as well as the ability to provide technical support and conduct training.

Qualifications

• Degree/Diploma in Mechanical/Electrical/Electronics Engineering or equivalent.
• Minimum 3 years of experience in Semiconductor or Manufacturing.
• Knowledge of equipment assembly and troubleshooting.

Responsibilities

• Perform setup, assembly, testing and maintenance of wire bonder equipment.
• Provide technical support related to assembly and drawing specifications.
• Conduct training and work with departments to achieve quality output.

Job description

A technology company based in Singapore is seeking a qualified individual for a technical role involving equipment assembly, testing, and maintenance of wire bonder equipment. Candidates must possess a degree in engineering and have at least 3 years of relevant experience in the semiconductor or manufacturing industries. Strong leadership and communication skills are essential, as well as the ability to provide technical support and conduct training.