Advanced Packaging Failure Analysis Technician

Micron Technology, Inc.; Singapore; On-site; SGD 42,000 - 60,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Physical Failure Analysis (PFA) Technician to perform electrical and physical failure analyses on advanced packaging products.

You will prepare samples, use SEM/EDX, FIB, X-ray and C-SAM, and document findings in FA reports with strict safety and quality discipline. Ideal candidates have 1–2 years' experience in semiconductor failure analysis, hands-on tool experience, and the ability to work independently or collaboratively across teams to

Qualifications

• Minimum NITEC, Higher NITEC or Diploma in Engineering or equivalent.
• 1–2 years of experience in semiconductor failure analysis.
• Hands-on experience with SEM/EDX, FIB, X-ray, C-SAM and sample prep tools.
• Knowledge of semiconductor wafer fabrication and advanced packaging processes.
• Strong communication and teamwork abilities with stakeholders.

Responsibilities

• Perform electrical and physical failure analysis on packaging products.
• Prepare samples, cross-section, decapsulation, polishing and microscopy inspections.
• Operate and maintain analytical equipment (optical microscopes, SEM, EDX, FIB, X-ray, C-SAM).
• Document FA findings and write FA reports promptly.
• Adhere to lab safety, SOPs, quality systems and 6S housekeeping.
• Support continuous improvement and share AI-enabled enhancements where applicable.

Skills

Self-motivated

Proactive

Communication

Independent worker

Education

NITEC / Higher NITEC or Diploma in Engineering

Tools

SEM/EDX

FIB

X-ray

C-SAM

Sample prep tools

Job description

Micron Technology, Inc. in Singapore is seeking a Physical Failure Analysis (PFA) Technician to perform electrical and physical failure analyses on advanced packaging products.

You will prepare samples, use SEM/EDX, FIB, X-ray and C-SAM, and document findings in FA reports with strict safety and quality discipline. Ideal candidates have 1–2 years' experience in semiconductor failure analysis, hands-on tool experience, and the ability to work independently or collaboratively across teams to