Senior Advanced Packaging & Reliability Engineer (2.5D/3D)

SHT SMART HIGH-TECH AKTIEBOLAG; Göteborgs kommun; On-site; SEK 900,000 - 1,150,000; Full time

Job summary

Smart High Tech is a Swedish DeepTech company delivering graphene-enhanced Thermal Interface Materials for next-generation semiconductor technologies. We seek a Senior Advanced Packaging & Reliability Engineer to join our R&D team and advance materials, interfaces and packaging reliability in collaboration with customers and institutes.

You will bridge simulation, experiments and product development, driving qualification of new materials and technology partnerships in an international setting.

Qualifications

• MSc or PhD in Electronic Packaging, Microelectronics, Materials Science, Mechanical Engineering, Applied Mechanics or related field.
• Experience in semiconductor packaging and/or power electronics packaging.
• Strong understanding of advanced packaging technologies, materials and interfaces.
• Experience in reliability engineering and/or failure analysis.
• Experience with thermo-mechanical modelling and finite element analysis.

Responsibilities

• Evaluate materials and interfaces for advanced semiconductor packaging applications.
• Work with 2.5D/3D integration, heterogeneous integration, flip-chip and wafer-level packaging.
• Develop and perform reliability assessments and testing.
• Investigate thermal, mechanical and interfacial failure mechanisms.
• Conduct failure analysis and root-cause investigations.
• Model stresses, deformation and failure mechanisms using simulation.

Skills

Finite Element Analysis

Thermal management

Reliability engineering

Failure analysis

Analytical skills

Education

MSc or PhD in Electronic Packaging or related

Tools

ANSYS

Abaqus

COMSOL

Job description

Smart High Tech is a Swedish DeepTech company delivering graphene-enhanced Thermal Interface Materials for next-generation semiconductor technologies. We seek a Senior Advanced Packaging & Reliability Engineer to join our R&D team and advance materials, interfaces and packaging reliability in collaboration with customers and institutes.

You will bridge simulation, experiments and product development, driving qualification of new materials and technology partnerships in an international setting.