Senior Hardware Engineer

DIS Tech | a Technoprobe company; Mandaue; On-site; PHP 900,000 - 1,200,000; Full time

Job summary

DIS Tech | a Technoprobe company is seeking a highly experienced Hardware Engineer specializing in RF, high-speed digital, high-current, and high-voltage design. You will simulate, validate, and mentor, delivering advanced semiconductor test hardware for AI, HPC, mobile, and RF applications.

You will drive design quality reviews, manage BOMs, and collaborate with global teams on mechanical, cable, and thermal aspects to ensure robust hardware solutions.

Qualifications

• 5+ years of experience in hardware design, PCB development, semiconductor test solutions, or related engineering fields.
• Strong foundation in electronic circuit design and complex hardware systems.
• In-depth expertise in RF, high-speed digital, high-current, and high-voltage design and layout.

Responsibilities

• Design high-complexity test hardware and PCB solutions for semiconductor devices.
• Develop ATE interface boards used in testing AI, HPC, mobile processors, and RF chips.
• Perform SI, PI, and RF simulations at board and system levels.
• Lead design reviews and ensure manufacturability and reliability.

Skills

RF design

High-speed digital

Power integrity

Design automation / scripting

Signal Integrity (SI) testing

Troubleshooting / problem solving

Education

Bachelor's degree in Electronics / Electrical / Mechatronics Engineering

Tools

Cadence PCB design tools

Job description

We are seeking a highly experienced Hardware Engineer with deep technical expertise in RF, high-speed digital, high-current, and high-voltage design. The ideal candidate will possess strong simulation, PCB library management, and design automation experience, while demonstrating the ability to perform rigorous design quality reviews and provide technical mentorship to other engineers. This individual will play a key role in developing advanced semiconductor test hardware solutions for AI, HPC, mobile, and RF applications.

KEY RESPONSIBILITIES

• Design high-complexity test hardware and PCB solutions for semiconductor devices.
• Develop ATE interface boards used in testing AI, HPC, mobile processors, and RF chips.
• Perform Signal Integrity (SI), Power Integrity (PI), and RF simulations at the board and system levels.
• Conduct device testing feasibility studies and risk analysis. Design and evaluate high-layer-count PCBs and test circuits.
• Collaborate with global teams on mechanical design, cable design, and thermal evaluation.
• Support end-to-end hardware project management from concept through delivery.
• Develop hardware documentation, schematics, design guidelines, and BOMs for fabrication and assembly.
• Research and evaluate new technologies, methodologies, and materials for next generation semiconductor testing solutions.
• Develop, maintain, and manage PCB component libraries, design standards, and engineering best practices.
• Drive hardware design automation initiatives through scripting, workflow improvements, and process optimization.
• Perform comprehensive design reviews and quality checks to ensure compliance with engineering standards, reliability requirements, and manufacturability guidelines. Lead technical troubleshooting, validation, root cause analysis, and continuous improvement activities.
• Provide technical leadership and mentorship to junior engineers, supporting skill development and knowledge sharing across the organization.

QUALIFICATIONS

• Bachelor's degree in Electronics, Electrical, Computer, or Mechatronics Engineering. Minimum of 5 years of experience in hardware design, PCB development, semiconductor test solutions, or related engineering fields.
• Strong foundation in electronic circuit design and complex hardware systems.
• In-depth expertise in RF, high-speed digital, high-current, and high-voltage design, including associated layout requirements, design constraints, and industry best practices.
• Proven experience with Cadence PCB design tools and high-layer-count PCB development.
• Strong understanding of Signal Integrity (SI), Power Integrity (PI), and RF design principles and simulation methodologies.
• Hands-on experience with simulation tools for SI, PI, RF, and thermal analysis.
• Solid knowledge of PCB manufacturing processes, stack-up development, controlled impedance design, and high-speed routing techniques.
• Experience developing and maintaining PCB libraries, design rules, and engineering standards.
• Knowledge of design automation, scripting, or engineering workflow automation tools is highly desirable.
• Proven ability to perform design quality reviews, validation, verification, and reliability assessments.
• Strong analytical, troubleshooting, and problem-solving skills with exceptional attention to detail.
• Demonstrated leadership capabilities, including mentoring and guiding junior engineers on complex hardware development projects.
• Experience supporting AI, HPC, semiconductor testing, networking, RF, or other high performance computing applications is highly preferred.
• Ability to work effectively in a cross-functional and global engineering environment.
• Open to occasional domestic and international travel as required for projects, customer engagements, and collaboration with global teams.