Semiconductor Failure Analysis Engineer - Fault Diagnostics

onsemi; Hinoba-an; On-site; PHP 600,000 - 900,000; Full time

Job summary

onsemi in Carmona, Cavite, Philippines, is seeking an engineer to perform full failure analysis until failure mechanism identification on internal and external customer returns. You will participate in projects and tasks assigned by the team leader/manager.

The role requires bench test tool proficiency, failure isolation techniques (Emission Microscopy, OBIRCH), chemical decapsulation, die-level mechanical probing, and clear reporting to customers and counterparts.

Qualifications

• BS degree in ECE, EE, Computer Engineering or equivalent in Semiconductor Physics/Electronics.
• Experience in failure analysis or product analysis is advantageous.
• Understanding of semiconductor physics related to transistors and ability to interpret schematics.
• Able to communicate clearly and prepare reports for customers.

Responsibilities

• Understand semiconductor device specifications.
• Knowledge of bench test tools and setup to verify device failure mode.
• Use failure isolation techniques such as Emission Microscopy, OBIRCH to determine failure mechanism.
• Chemical handling for chemical decapsulation procedures.
• Mechanical microprobing at die-level for nodal analysis.
• Understand device schematics at transistor level.
• Prepare reports and interact with customers and counterparts.

Skills

Semiconductor physics

Device schematics

Failure analysis tools

Image sensor devices

Report writing

Interpersonal skills

Education

Bachelor in ECE/EE/Computer Eng

Tools

Emission Microscopy

OBIRCH

Job description

onsemi in Carmona, Cavite, Philippines, is seeking an engineer to perform full failure analysis until failure mechanism identification on internal and external customer returns. You will participate in projects and tasks assigned by the team leader/manager.

The role requires bench test tool proficiency, failure isolation techniques (Emission Microscopy, OBIRCH), chemical decapsulation, die-level mechanical probing, and clear reporting to customers and counterparts.