Wafer Bonding Physicist for 3D Chip Integration

Utwentecareers; Enschede; Remote; EUR 41,000 - 64,000; Full time

Benefits offered by this job

CAO-NU salary framework

8% holiday allowance

8.3% year-end bonus

Pension scheme

Leave entitlement (232 hours)

Job summary

The University of Twente's XUV Optics Group invites applications for a postdoctoral project focused on quantitative wafer bonding and surface metrology. You will develop experimental methods, perform bonding measurements, and apply AFM, WLI, XPS, FTIR and related techniques to connect surface properties with bonding performance for next-generation 3D chip integration.

The position offers hands-on research, data analysis, and collaboration with industrial partners, with a 2-year full-time

Qualifications

• PhD in a relevant field (materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering)
• Experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor materials
• Familiar with surface analysis techniques such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry
• Ability to relate experimental results to physical models and quantitative data analysis

Responsibilities

• Develop and validate experimental methods for wafer bonding in a quantitative, physics-based framework
• Perform wafer bonding measurements and apply surface metrology techniques
• Interpret results and contribute to predictive relations for 3D chip integration

Skills

Hands-on lab work

Team collaboration

English proficiency

Data analysis

Education

PhD in materials science

PhD in surface science

PhD in applied physics

Tools

AFM

WLI

XPS

FTIR

Ellipsometry

Job description

The University of Twente's XUV Optics Group invites applications for a postdoctoral project focused on quantitative wafer bonding and surface metrology. You will develop experimental methods, perform bonding measurements, and apply AFM, WLI, XPS, FTIR and related techniques to connect surface properties with bonding performance for next-generation 3D chip integration.

The position offers hands-on research, data analysis, and collaboration with industrial partners, with a 2-year full-time