Tape Out Engineer

NXP Semiconductors; Netherlands; On-site; EUR 80,000 - 110,000; Full time

Job summary

NXP Semiconductors is seeking a Tape Out Engineer to guide the final design handoff to fabrication, ensuring physical and logical data meet stringent manufacturing standards. You will coordinate with design, program management, technologists, and manufacturing teams to resolve issues and drive manufacturability.

The role requires a Bachelor's in Electrical/Computer Engineering (Master's preferred), hands-on experience with Cadence and Synopsys, and strong attention to detail under tight

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
• Master's degree preferred.
• Experience with physical design tools and manufacturing workflows.
• Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.
• Willingness to work with flexible working hours for critical tape-outs.
• Effective communication in English for collaboration across technical teams.

Responsibilities

• Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
• Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
• Work collaboratively with cross-functional teams to resolve technical issues and optimize designs for manufacturability.
• Ensure all deliverables conform to foundry requirements.
• Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Skills

Attention to detail

Problem solving

English communication

Education

Bachelor's degree in Electrical Engineering or Computer Engineering

Master's degree preferred

Tools

Cadence

Synopsys

Job description

Role Overview, Responsibilities, and Qualifications

The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes.

Key Responsibilities

• Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
• Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
• Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability.
• Ensure all deliverables conform to foundry requirements.
• Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related field (Master's preferred).
• Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows.
• Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.
• Willingness to work with flexible working hours to support critical Tape-outs.
• Effective communication in English for collaborating across technical teams.

This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

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