PCB/RF Design Engineer

QuantWare BV; Delft; Híbrido; EUR 70.000 - 95.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Competitive salary

Pension

Hybrid work

L&D budget

Descripción de la vacante

QuantWare is seeking an RF/PCB Design Engineer to drive the physical realization of our next‑generation 3D quantum hardware. You will own the design of cryo‑compatible PCBs and interconnects, and work with the packaging and product design teams to integrate hardware and software.

The role requires 4+ years of hands‑on PCB design experience (KiCAD, Altium, Cadence), experience with LTCC/HTCC or cryogenic environments, and strong RF/EMI fundamentals.

Formación

• Education: BSc or MSc in Electrical Engineering with PCB design, RF/Microwave emphasis.
• 4+ years hands-on PCB design experience with KiCAD, Altium Designer and Cadence.

Responsabilidades

• Own the design of critical RF/PCB components for cryogenic QPU packaging.
• Create high-density cryo-compatible PCB layouts and interconnects.
• Collaborate with packaging and product design teams to integrate hardware with software workflows.
• Validate designs across full temperature range from room temp to millikelvin with proper testing.

Conocimientos

PCB design

RF/Microwave engineering

Cryogenic environments

Educación

BSc or MSc in Electrical Engineering

Herramientas

KiCAD

Altium Designer

Cadence

Descripción del empleo

About Us

QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.

With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in!

Join us as a RF/PCB Design Engineer to drive the physical realization of our next-generation 3D quantum hardware architecture - hardware that operates from room temperature down to millikelvin conditions inside a dilution refrigerator. You will own the design of critical microwave components, create high-density cryo-compatible PCB layouts, and build novel packaging solutions for large-scale QPUs. Working at the intersection of hardware and software, you'll also help streamline our development by embedding design processes into automated workflows.

What you'll be doing

• Component & Mechanical Design: Design critical electromechanical components that form the chief interface of our QPUs and TWPAs. You will work as part of the packaging team and interface closely with the Product design team.

• Precision Engineering: Utilise CAD to design PCBs, silicon chip layout and PCB-to-chip interconnect within the vertical VIO architecture.

• RF/Microwave Design: Solve complex challenges related to insertion loss, impedance matching, and cross-talk at the PCB and package levels.

• Cryogenic Integration & Testing: Design for and validate performance across the full temperature range from room temperature to millikelvin — accounting for thermal cycling, differential contraction, and material behavior at cryogenic temperatures, and running cooldown/characterization tests in dilution refrigerators.

Your Profile

• Education: BSc or MSc in Electrical Engineering with a focus on PCB design, layout, and RF/Microwave Engineering.

• Experience: 4+ years of hands‑on PCB design experience utilizing tools such as KiCAD, Altium Designer, and Cadence to deliver high‑quality board designs. Experience with diverse materials such as cofired ceramic boards (LTCC, HTCC) is a plus.

• Cryogenic Applications: Hands‑on experience designing or testing hardware for cryogenic environments - e.g., dilution refrigerators, cryostats, or low‑temperature RF/microwave systems.

• Core EE Fundamentals: Solid understanding of developing schematics, electro‑mechanical interfaces, RF layout trades, temperature dependent behavior, shielding, signal integrity, and impedance analysis.

Nice to Have:

• Packaging & Interconnects: Background in high‑density interconnects, high frequency flex interconnects, 3D packaging, or advanced integration.

• Domain Knowledge: Familiarity with superconducting technologies is a strong plus.

• RF Characterization: Practical experience with RF testing and measurements using VNA and related laboratory equipment.

What We Offer:

At QuantWare, you’ll be part of a high‑performing team of world‑class experts in an ambitious, fast‑moving environment. From day one, you’ll have the trust, tools, and support to do your best work. Here’s what you can expect:

Competitive salary - A salary that reflects the impact and importance of the role (and of course 8% holiday allowance)

Pension that’s built to last - A generous and future‑proof pension plan that includes partner and dependent coverage.

Flexibility built on trust - We focus on outcomes. Work flexibly, in a hybrid setup, with an open vacation policy that lets you manage your time

Personal growth - We invest in your L&D, with a budget available to each team member, dependent on their individual ambitions, development needs, and performance

A connected team - We make space to celebrate wins together, with team events, offsites, and spontaneous moments that bring us closer

Diversity & Inclusion at QuantWare

We’re an ambitious company, not only for our goals but also to become an even more diverse and inclusive team. We know great candidates don’t always follow a straight path, and we value diverse experience, perspectives, and ways of thinking. We know this helps us make better decisions, drives more innovation, and strengthens our culture.

As part of our recruitment process, candidates may be required to undergo pre‑employment screening.