Internship – Packaging Optimization & Quality Improvement

Frencken

Eindhoven

On-site

EUR 4,500 - 7,800

Full time

14 days+

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Job summary

Frencken Machining offers an internship focused on packaging quality improvements to reduce scratches and damage during handling. You will work with Production, Quality, Engineering and Supply Chain to analyze data, define requirements, and document actionable improvements.

The role covers developing proposals, updating Coscom/Glovia instructions, and creating work instructions for operations. 6-month, full-time internship in Eindhoven.

Qualifications

  • HBO/WO student in Industrial/Mechanical Engineering, Supply Chain, or Data Analytics
  • Interest in packaging quality improvement and manufacturing processes

Responsibilities

  • Analyze historical reject data related to packaging damage and scratches
  • Identify trends, root causes, and opportunities for improvement
  • Quantify the impact of packaging-related defects and potential PPM reductions
  • Define packaging requirements for different product categories
  • Develop and document packaging improvement proposals
  • Implement packaging instructions in Coscom and Glovia systems
  • Create clear work instructions and documentation for operational teams
  • Support implementation and validation of proposed improvements

Skills

Technical drawing comprehension
Analytical problem-solving
Strong communication
Team-oriented and proactive
Results-driven with practical approach
Comfortable in production environment

Education

HBO student (2nd year or graduation internship)
WO Bachelor or Master student

Tools

Glovia
Coscom

Job description

Project Overview

At Frencken Machining, we continuously strive to improve product quality and customer satisfaction. Currently, some products experience damage or scratches during transportation and handling due to packaging limitations, resulting in rejects and additional costs. The goal of this project is to analyze historical packaging-related quality issues, identify improvement opportunities, and implement optimized packaging solutions to reduce defects and improve overall product quality.

Your Challenge

During this internship, you will investigate packaging-related rejects, analyze quality data, and develop practical improvements that can be implemented throughout the organization. You will work closely with Production, Quality, Engineering, and Supply Chain teams to ensure packaging solutions meet technical and operational requirements.

Key Responsibilities
  • Analyze historical reject data related to packaging damage and scratches
  • Identify trends, root causes, and opportunities for improvement
  • Quantify the impact of packaging-related defects and potential PPM reductions
  • Define packaging requirements for different product categories
  • Develop and document packaging improvement proposals
  • Implement packaging instructions in Coscom and Glovia systems
  • Create clear work instructions and documentation for operational teams
  • Support implementation and validation of proposed improvements
Expected Deliverables
  • Packaging improvement roadmap
  • Analysis of packaging-related quality issues and reject rates
  • Recommendations for reducing packaging-related defects
  • Updated packaging instructions in Coscom
  • Updated packaging information in Glovia
  • Final report with findings, recommendations, and implementation plan
What We Are Looking For
Education
  • HBO student (2nd year or graduation internship)
  • WO Bachelor or Master student
Preferred Fields Of Study
  • Industrial Engineering
  • Mechanical Engineering
  • Supply Chain Management
  • Logistics Engineering
  • Manufacturing Engineering
  • Data Analytics
  • Business Engineering
Skills
  • Ability to understand technical drawings and documentation
  • Analytical and problem-solving mindset
  • Strong communication skills
  • Team-oriented and proactive
  • Result-driven with a practical approach
  • Comfortable working in a production environment
What You Will Learn
  • Quality improvement methodologies
  • Root cause analysis
  • Manufacturing and packaging processes
  • ERP and manufacturing systems (Glovia & Coscom)
  • Cross-functional project management
  • Data-driven decision-making in a high-tech manufacturing environment
Internship Details

Location: Frencken Machining
Duration: 6 months
Full-time internship

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