Wire Bond Process Engineer: Optimize Quality & Yield

Renesas Electronics; Selangor; Hybrid; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor solutions provider in Malaysia is seeking a skilled professional to develop, optimize, and implement wire bonding processes for new semiconductor products. Candidates should have a Bachelor's degree in engineering and at least 2 years of experience in the semiconductor industry. This role offers a hybrid work model with opportunities for career advancement in a collaborative environment.

Benefits

Remote work options

Flexible work environment

Qualifications

• 2+ years of experience in the semiconductor industry preferred.
• Ability to handle operations and recipe making for wire bonding machines.

Responsibilities

• Develop and implement wire bonding processes.
• Perform process characterization through Design of Experiments.
• Create and maintain manufacturing documentation.

Skills

Wire bonding process optimization

Troubleshooting defects

Knowledge of K&S and Shinkawa machines

Education

Bachelor’s degree in engineering

Job description

A leading semiconductor solutions provider in Malaysia is seeking a skilled professional to develop, optimize, and implement wire bonding processes for new semiconductor products. Candidates should have a Bachelor's degree in engineering and at least 2 years of experience in the semiconductor industry. This role offers a hybrid work model with opportunities for career advancement in a collaborative environment.