Staff Engineer, Product Development

Celestica Inc.; Kulim; On-site; MYR 240,000 - 360,000; Full time

Benefits offered by this job

Career development programs

Global opportunities

Job summary

Celestica Inc. is seeking a senior hardware engineering leader in Malaysia to drive design-for-manufacturability and end-to-end NPI for cutting-edge AI ASICs and high-density PCBs.

You will lead cross-functional teams across Product Management, Design Engineering, Supply Chain, Quality and Operations to ensure manufacturability, reliability, and timely ramp to mass production.

Qualifications

• 10+ years of experience in Product Engineering, Hardware Engineering, or Technical Leadership driving failure analysis and yield improvement.
• Expertise in semiconductor IC architecture, physics, and failure modes.
• Design process mastery in manufacturing and test processes with board design knowledge.
• Data-driven problem solving with root-cause analysis and yield analysis.
• Cross-functional and supplier leadership involving internal teams, customers, and IC vendors.

Responsibilities

• Drive DFX leadership including DFM/DFT reviews early in product development.
• Lead NPI process development with EVT/DVT/PVT planning and yield improvement.
• Coordinate cross-functional alignment across Product Management, Design Engineering, Supply Chain, Quality, and Manufacturing Operations.
• Spearhead CAPA investigations and implement permanent corrective actions.
• Oversee build planning and mass-production ramp schedules across engineering and operations teams.

Education

Bachelor’s or Master’s degree in Electrical and Electronics Engineering, Mechanical Engineering, Systems Engineering, Computer Engineering

Tools

ASIC knowledge

Job description

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Date: Oct 8, 2026

General Overview

Functional Area: Engineering
Career Stream: Process Engineering Manufacturing
SAP Short Name: SLE-ENG-PRM
IC/MGR: Individual Contributor
Direct/Indirect Indicator: Indirect

Summary

• New Technology Integration: Rapidly assimilate new technologies,components, and architectural paradigms to assess technical feasibility,manufacturability, and commercial viability.
• Design-to-Operations Bridge: Collaborate closely with Hardware,Software, and Industrial Design teams to align product specifications withoperational capabilities.
• DFX Leadership: Drive Design for Manufacturability (DFM), Design forAssembly (DFA), and Design for Test (DFT) reviews early in the productdevelopment lifecycle to eliminate downstream operational bottlenecks.
• NPI Process Development: Collaborate with Advanced Process Engineersto pioneer and optimize advanced manufacturing processes and test solutionsfor New Product Introduction (NPI) of next-generation products built oncutting-edge AI ASICs, high-density PCBs, and advanced high-speedconnectors and cabling systems.
• NPI Execution: Lead build planning (EVT/DVT/PVT), yield improvement, product qualification, and mass-production ramp schedules across internal engineering and operations teams.
• Root Cause Analysis CAPA: Spearhead deep-dive investigation of complex hardware, IC/ASIC, and component failure modes and implement permanent CAPA.
• Cross-Functional Alignment: Serve as the central technical point of contactacross Product Management, Design Engineering, Supply Chain, Quality, andManufacturing Operations.

Typical Experience

• 10+ years of experience in Product Engineering, Hardware Engineering, or Technical Leadership driving failure analysis, CAPA, and yield improvement in high-tech manufacturing.
• Semiconductor ASIC Expertise: Superior understanding ofsemiconductor IC architecture, physics, and failure modes exceeding peer expertise in Design Team and manufacturing site.
• Design Process Mastery: Exceptional expertise in manufacturing and testprocesses, exceeding that of design engineers, suppliers, and customers, coupled with a comprehensive schematic and board design knowledge.
• Data-Driven Problem Solving: Strong analytical background skilled in root-cause analysis, statistical process control, and yield analysis.
• Cross-Functional & Supplier Leadership: Proven experience leading technical taskforces involving internal teams (Process, Test, Debug, Quality), Design Team, customers, and key IC vendors.
• AI Data Center Hyperscaler Architecture: Deep understanding of AI DataCenter architecture, current and emerging technologies surroundinghyperscaler AI servers, switches, and storage, while continuously keepingpace with future technology developments and market releases.

Typical Education

• Education: Bachelor’s or Master’s degree in Electrical and ElectronicsEngineering, Mechanical Engineering, Systems Engineering, ComputerEngineering, or a related technical discipline.

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.

Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).

At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.

COMPANY OVERVIEW:

Celestica, Inc. (NYSE: CLS; TSX: CLS) is a technology leader dedicated to driving customer success and market advancements. With deep expertise in design, engineering, manufacturing, supply chain, and platform solutions, Celestica enables critical data center infrastructure for AI, cloud, and hybrid cloud and advances technologies in high-growth markets. With a talented team and a strategic global network, Celestica helps its customers achieve competitive advantages.

Today, Celestica delivers innovative supply chain solutions globally to customers in strategic two operating and reporting segments: Advanced Technology Solutions (ATS) and Connectivity and Cloud Solutions (CC):

ATS: This segment serves customers in complex, regulated and high-reliability markets such as Industrial & Smart Energy, Aerospace & Defense, Semiconductor Capital Equipment, and HealthTech. It is engineering led, with deep expertise in design, manufacturing and lifecycle solutions.

CCS: This segment focuses on high-performance technology solutions and services for the data center, serving hyperscalers, digital native customers and enterprises. Celestica's Platform Solutions offering provides innovative and customizable computing, storage and networking solutions enabling AI-driven growth.

Built on a legacy of trust and performance, Celestica has earned its reputation by delivering results in complex and fast-changing markets. Celestica exceeds customer expectations by identifying trends and staying ahead of the curve. Backed by comprehensive capabilities and a global network across North America, Europe and Asia, Celestica helps customers gain competitive advantage with the quality, flexibility and resiliency they need to respond quickly to shifts in demand. Guided by a bold vision to accelerate market advancements, Celestica delivers innovative solutions and technologies that turn complexity into opportunity. Anchored in teamwork and commitment, Celestica strives to be the most trusted partner to its customers and colleagues worldwide.

Job Segment: Cloud, Supply Chain, Hardware Engineer, Mechanical Engineer, Testing, Technology, Operations, Engineering