Staff Engineer Frontend-Backend Integration

Infineon Technologies AG; Kulim; On-site; MYR 150,000 - 200,000; Full time

Job summary

Infineon Technologies AG is seeking a seasoned engineer with a PhD or Master's degree to lead process analysis and defect prevention in semiconductor solutions. The role demands expertise in characterization methodologies and material science, aiming to drive innovation and enhance reliability in processes. Join a diverse team dedicated to creating efficient, sustainable solutions that make life easier, safer, and greener.

Qualifications

• 5+ years of in-depth knowledge in characterization methodology.
• Good knowledge in chip-to-package interactions and FOL processes.
• Self-starter with the ability to work independently and in teams.

Responsibilities

• Perform root cause analysis and evaluate defect prevention methodologies.
• Conduct interconnect-related process analysis and develop innovative processes.
• Integrate technical support for new technology transfer projects.

Skills

Characterization methodology

Material science

Advanced failure analysis

Problem-solving methodologies

Interpersonal skills

Analytical skills

Leadership skills

Education

PhD/Master's Degree in Physics/Chemistry/Material Science/Mechanical Engineering/Electronics Engineering

Job description

Perform root cause analysis for ICO/FAR related defects, evaluate defect prevention methodologies in relevant unit processes

Job Description
In your new role you will:

• Perform root cause analysis for ICO/FAR related defects, evaluate defect prevention methodologies in relevant unit processes
• Benchmark and perform interconnect-related process analysis for existing and new technologies to achieve maximum process capability against benchmark and work with UPS and BE engineering to eliminate defects and drive continuous improvement
• Integration technical support in new technology transfer projects.
• Development of innovative processes and process characterization methodologies for existing and new interconnect technologies.
• Design & execute experiments and perform technical analysis & documentation on the results.
• Assessment of process changes and process change management
• Interface between business units, process engineering, frontend and backend sites, reliability engineering and production
• Interact and communicate effectively in cross functional teams e.g. in8D teams and taskforces.

Your Profile
You are best equipped for this task if you have:

• PhD/Master/ Degree in Physics/Chemistry/Material Science/Mechanical Engineering/Electronics Engineering or equivalent
• At least 5 years of in-depth knowledge of characterization methodology on packaging assembly materials and processes
• Good knowledge in material science, metallurgy, polymer science, advanced failure analysis (fractures, inter metallics & microstructure, interfacial adhesion, surface & chemical analysis, outgassing, stress)
• Good technical knowledge in chip-to-package interactions with regards to interconnect reliability, materials and processes (wafer saw, die attach, wire bonding, flip chip bonding, molding. All-round expertise in FOL processes preferred)
• Good experience in problem solving methodologies and design of experiment.
• Good interpersonal skills, analytical and leadership skills & a good team player
• Must be a self-starter who can work both independently and in groups across different site functional teams.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.