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Renesas Electronics Corp. in Penang seeks a Senior Staff Package Design Engineer to oversee backend semiconductor packaging processes at OSATs.
You will be the primary technical interface between Renesas and OSATs, ensuring quality, yield and on-time release of packages. You will collaborate with NPI, Supply Chain and Quality teams, enforce standards, and participate in audits while driving continuous improvement in packaging technologies, with preference for automotive product experience.
Senior Staff Package Design Engineer overseas the Backend Semiconductor manufacturing processes and activities at OSATs. Be the primary technical interface between Renesas and OSATs.
Note: OSAT – Outsourcing Subcontractor Assembly & Test
Key Responsibilities
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .