Senior Staff Engineer Reliability Methodology, Assessment & Processes

Infineon Technologies; Malacca City; On-site; MYR 70,000 - 90,000; Full time

Job summary

A leading semiconductor company in Malacca City is seeking a Reliability Functions owner for Package Development Projects. The ideal candidate has a Master's or Bachelor's degree in Engineering or Science, with 3-5 years of experience in semiconductor manufacturing. Responsibilities include implementing reliability tests and analyzing failure mechanisms. The role demands strong analytical skills and expertise in reliability assessment.

Qualifications

• 3-5 years of relevant working experience in semiconductor manufacturing.
• Strong analytical and problem-solving skills.
• Knowledge of assembly and interconnect technology of electronic devices.

Responsibilities

• Owner of Reliability Functions for Package Development Projects.
• Implement major reliability tests according to project scope.
• Prepare comprehensive reports and provide RQ expertise.

Skills

first-level reliability test objectives

FMEA

analytical skills

reliability assessment

Education

Master’s or Bachelor’s degree in Engineering or Science

Job description

Owner of Reliability Functions for Package Development Projects.

Your Role

Key responsibilities in your new role

• First-Level Reliability: Good understanding of first-level reliability test objectives, requirements, and parameters; proficient in international specifications (JEDEC, AEC, IPC).
• Package Integrity Tests: Proficient in implementing major reliability tests according to project scope and requirements, based on project Delta Analysis, FMEA, and other relevant methods.
• Internal Package Analysis: Basic knowledge of FA analysis tools and methods, with the ability to apply them to completed reliability stress test samples; capable of preparing comprehensive reports and providing RQ expertise for proposals and recommendations.
• Second-Level Reliability: Basic understanding, implementation, and coordination of second-level reliability tests within RQ.
• Chip/Package/Board Co-Design (CPiB): Proficient in CPiB and its implementation for robust packaging reliability execution and qualification through to product release.

Your Profile

Qualifications And Skills To Help You Succeed

• Master’s or Bachelor’s degree in Engineering (Electrical, Electronics, Microelectronics, Mechatronics, or Semiconductor Technology) or Science (Chemistry, Physics, or Materials).
• Minimum 3–5 years of relevant working experience in the field or industry.
• Strong analytical and problem-solving skills, engineering analysis expertise, and experience in reliability assessment and stress requirements.
• Able to analyze and conclude root causes from failure mechanisms, have knowledge of assembly and interconnect technology of electronic devices, and contribute to FMEA based on experience with customer complaints and yield analysis.

This position is open only to candidates with semiconductor manufacturing experience.

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