Senior Staff Engineer Package Technology Development

Infineon Technologies; Ipoh; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading semiconductor company located in Malaysia is seeking a skilled professional to lead IC package development and new product introduction. The role demands at least 5 years of experience in package/process development in semiconductor packaging, ensuring projects meet strict technical, quality, and cost requirements. Candidates should be proficient in AutoCAD and have strong analytical skills. Opportunities to drive innovations in energy-efficient technologies await you.

Qualifications

• Minimum 5 years of package/process development in semiconductor packaging.
• Proficient in analytics and problem-solving tools.
• Ability to work with simulation software for FEA & thermal analysis.

Responsibilities

• Lead IC package development and product introduction.
• Ensure project meets customer requirements for timeline and quality.
• Interact closely with cross-functional teams and subcon engineering.

Skills

Package/Process development

AutoCAD

DFMEA

Delta Analysis

Problem solving

Simulation tools

Thermal analysis

Education

Master / Bachelor Degree in Engineering

Tools

AutoCAD 3D

Inventor

SolidWorks

ANSYS

Job description

To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved.

Your Role

• Responsible for all technical aspects of new product/package/new process development.
• Ensure that the project meets customer requirements in terms of timeline, cost and quality.
• Provide and/or review design proposals for package including components.
• Provide technical direction related to problem solving of process and reliability issues.
• Close interaction with the cross functional team for new product design and project roadmaps.
• Work closely with the subcon engineering teams to ensure process readiness and effective execution of development activities to meet Infineon project requirements.

Your Profile

• Master / Bachelor Degree in Engineering (Minimum requirement 5 Years of Package/Process development in Semiconductor packaging).
• Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D and simulation.
• Proficient in AutoCAD for 2D drawing. Knowledge using 3D software (AutoCAD 3D, Inventor, & SolidWorks) is an advantage.
• Exposure to the development of a wide variety of packages: MEMS packages, Flip Chip, WLCSP, QFN.
• Understanding/Interpretation of package simulation software ( ANSYS & SolidWorks) for FEA & thermal analysis is an advantage.
• Working knowledge of DFMEA during design phase and ability to create strategy to mitigate risk.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

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