Senior Project Manager Package Development

Infineon Technologies; Malacca City; On-site; MYR 289,000 - 372,000; Full time

Job summary

A global leader in semiconductor solutions is seeking an experienced professional to lead package/process development projects. This role involves managing innovation projects, change management, and leading international teams. Ideal candidates will have a Master's degree in relevant fields, 7+ years of semiconductor technology experience, and strong communication skills in English and Chinese. This position is located in Malacca, Malaysia and offers a dynamic work environment focused on diversity and inclusion.

Qualifications

• Minimum 7 years of experience in semiconductor technology manufacturing and assembly.
• At least 5 years of experience in leading complex development projects.
• IPMA C certification or equivalent is required.
• Strong technical background with advanced packaging technologies.
• Experience working with semiconductor subcontractors is advantageous.

Responsibilities

• Lead package/process development projects in collaboration with various units.
• Oversee package innovation projects from definition to integration.
• Manage change management projects related to package or process.
• Support package platform assessments and roadmap alignment.
• Lead international and multidisciplinary teams across regions.

Skills

Semiconductor technology manufacturing

Advanced packaging technologies

Cross-functional team leadership

Strong communication skills

Knowledge in PCB manufacturing

Education

Master's degree in Mechanical/Electrical/Material Science/Physics

PhD

Job description

Be responsible for package/process development projects in close collaboration with all Infineon Business Units and global subcon partners, ensuring robust technical maturity and seamless transition into serial production. Focus will be on PCB Embedding and Panel Level Packaging for next generation Power Modules.

Job Description

• Be responsible for package/process development projects in close collaboration with all Infineon Business Units and global subcon partners, ensuring robust technical maturity and seamless transition into serial production. Focus will be on PCB Embedding and Panel Level Packaging for next generation Power Modules.
• Lead package innovation projects starting from package/technology definition towards high volume integration.
• Be responsible for enabling and releasing new subcons, package/technology platforms, as well as subsequent derivatives.
• Be responsible for change management projects, handling major changes to package, process or subcon.
• Lead international and multidisciplinary teams (Europe, US, Asia).
• Support package platform assessments between subcons, as well as second source introduction.
• Support subcon/technology roadmap alignment.

Your Profile

• A Master degree in Mechanical/Electrical/Material Science/Physics disciplines or related qualifications. PhD is a plus.
• Minimum 7 years of experience in semiconductor technology manufacturing and assembly.
• At least 5 years of experience in leading complex development projects and IPMA C certification or equivalent.
• A strong technical background and experience with advanced packaging technologies and assembly processes.
• Knowledge in PCB manufacturing, chip embedding, power module packaging and assembly including related manufacturing processes is a plus.
• Experience of working with or within semiconductor subcontractors.
• Good understanding of quality requirements of semiconductor products and packages.
• The ability to work in and lead cross‑functional and global teams in a multicultural environment.
• Strong communication skills in English and Chinese, German is a plus.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills. Learn more about our various contact channels.

We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

Click here for more information about Diversity & Inclusion at Infineon.