Senior Packaging Programs Lead — Advanced Substrates

Intel; Kulim; On-site; MYR 327,000 - 491,000; Full time

Job summary

A leading technology company is seeking a highly motivated professional for an advanced packaging role in Kulim, Malaysia. The successful candidate will work on innovative substrate packaging technologies and collaborate with global suppliers. Candidates should have at least 8 years of experience in substrate manufacturing, a degree in Science or Engineering, and strong communication skills in English. The position requires substantial on-site presence and offers an opportunity to influence supplier processes directly.

Benefits

On-site presence required

Collaboration with diverse teams

Opportunities for travel

Qualifications

• 8+ years of experience in fab back-end or substrate manufacturing process development required.
• Experience qualifying process tools in a TD/ramp context is preferred.

Responsibilities

• Collaborate with on-site supplier engineering teams to advance substrate technologies.
• Monitor and improve capacity in bottleneck processes.
• Conduct thorough analysis of substrate lead times and develop reduction roadmaps.

Skills

Capacity management

Lead time analysis

Structured problem solving

Supplier influence

Stakeholder management

Fluent English

Education

Bachelor's or Master's degree in Science or Engineering

PhD with 4+ years work experience

Tools

Process Control Systems

Laser drilling equipment

Metrology tools

Job description

A leading technology company is seeking a highly motivated professional for an advanced packaging role in Kulim, Malaysia. The successful candidate will work on innovative substrate packaging technologies and collaborate with global suppliers. Candidates should have at least 8 years of experience in substrate manufacturing, a degree in Science or Engineering, and strong communication skills in English. The position requires substantial on-site presence and offers an opportunity to influence supplier processes directly.