Senior Mechanical Design Engineer

754 Altera Semiconductor Technology (M) Sdn. Bhd.

George Town

On-site

MYR 180,000 - 260,000

Full time

2 days ago
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Job summary

754 Altera Semiconductor Technology (M) Sdn. Bhd. in Penang, Malaysia, seeks a Senior Mechanical Engineer to lead mechanical design and thermal engineering for FPGA platforms, PCIe cards, and development kits. You will translate requirements into robust hardware from concept through validation and production release.

The role demands 10+ years of hands‑on electronics experience, strong judgment, and collaboration with cross‑functional teams across supplier and manufacturing partners.

Qualifications

  • Bachelor’s degree in mechanical engineering or a closely related field; advanced degree is a plus.
  • 10+ years of professional experience in mechanical design for electronics, FPGA, or related platforms.
  • Proficiency with Creo and/or SolidWorks for complex part and enclosure design; release-ready drawings.
  • Experience with thermal simulation tools such as ANSYS Icepak or FloTHERM; lab correlation.
  • Strong heat transfer knowledge including conduction, convection, and thermal paths.
  • Experience designing around PCBs, PCIe cards, sockets, and system interfaces.
  • Knowledge of CNC machining, sheet metal, injection molding, and related manufacturing.
  • Ability to lead across multiple projects and travel occasionally.

Responsibilities

  • Own mechanical architecture for engineering validation boards and related hardware.
  • Create and maintain 3D CAD designs, assemblies, and production drawings.
  • Develop heatsink and thermal-management solutions for high‑power designs.
  • Perform thermal simulations; correlate models with lab measurements and iterate.
  • Lead tolerance analysis, structural checks, DFx reviews, and design‑for‑reliability work.
  • Drive design execution from concept to release of complete documentation.
  • Plan hands‑on bring‑up, environmental testing, and validation activities.
  • Collaborate with electrical, PCB, silicon, and program teams to resolve cross‑domain constraints.
  • Engage with contract manufacturers and vendors on DFM/DFA, tooling, and lead times.
  • Communicate risks, trade‑offs, schedules, and mitigation plans to leadership.

Skills

Technical leadership
Cross-functional collaboration
Problem solving

Tools

Creo
SolidWorks
ANSYS Icepak
FloTHERM
CFD
CNC Machining
Sheet metal
Injection molding

Job description

Position Overview

Altera is seeking an experienced Senior Mechanical Engineer to lead the mechanical design and thermal engineering of engineering validation boards, FPGA platform prototypes, PCIe cards, accessories cards, and Altera Development Kits. This role converts system, board, package, power, and application requirements into robust, manufacturable hardware solutions—from early concept and CAD architecture through simulation, prototype build, validation, and production release. The ideal candidate brings 10+ years of hands‑on experience, strong technical judgment, and a track record of delivering complex electronics platforms in partnership with electrical, silicon, package, validation, manufacturing, and supplier teams.

What You Will Do
  • Own mechanical architecture for engineering validation boards, FPGA development platforms, PCIe cards, accessories cards, evaluation systems, and related accessories, balancing performance, reliability, schedule, cost, and manufacturability.
  • Create and maintain detailed 3D CAD designs, assemblies, layouts, and production drawings using Creo and/or SolidWorks; define interfaces, mounting schemes, board keep-outs, stack-ups, brackets, covers, enclosures, sockets, and heatsink assemblies.
  • Develop heatsink and thermal‑management solutions for high‑power FPGA and board‑level designs, including thermal interface materials, airflow paths, fans, heat spreaders, conduction paths, and mechanical retention features.
  • Perform and interpret thermal simulations using ANSYS Icepak, FloTHERM, CFD, or equivalent tools to predict temperature, airflow, pressure drop, and thermal margin; correlate models with lab measurements and drive design iterations.
  • Lead tolerance analysis, structural checks, vibration/shock considerations, thermal‑mechanical stack‑up reviews, and design‑for‑reliability assessments for prototype and production‑intent hardware.
  • Drive design execution from requirements and feasibility through concept reviews, design reviews, prototype fabrication, engineering validation, issue resolution, and release of complete technical documentation.
  • Plan and support hands‑on bring‑up and validation activities, including fit and function checks, environmental testing, failure analysis, and root‑cause/corrective‑action closure.
  • Partner with electrical, PCB, silicon, package, power, signal integrity, validation, compliance, and program teams to resolve cross‑domain constraints and deliver platform‑level solutions with minimal iteration.
  • Collaborates with thermal engineers to optimize the design parameters, deliver performance objectives, and partner with external vendors through initial conceptual studies, layout, design, fabrication, assembly, and validation.
  • Engage contract manufacturers, machining houses, sheet‑metal and injection‑molding suppliers, and component vendors on DFM/DFA, tooling, material selection, cost, lead time, quality, and production readiness.
  • Establish and communicate mechanical/thermal risks, assumptions, trade‑offs, schedules, and mitigation plans to engineering leadership and program stakeholders; mentor engineers and raise the team’s design and simulation standards.
  • Maintain accurate CAD databases, drawings, specifications, simulation reports, validation data, change records, and technical presentations in accordance with Altera engineering processes.
Qualifications
  • Minimum Qualifications Bachelor’s degree in mechanical engineering or a closely related engineering discipline; advanced degree is a plus.
  • 10+ years of professional experience in mechanical design and engineering for complex electronics, computing, semiconductor, FPGA, networking, or instrumentation platforms.
  • Demonstrated hands‑on proficiency with Creo and/or SolidWorks for complex part, assembly, enclosure, board‑level, and heatsink design; able to produce clear, release‑quality drawings.
  • Hands‑on experience with thermal simulation tools such as ANSYS Icepak, FloTHERM, or equivalent CFD/thermal modeling platforms, including model setup, boundary conditions, interpretation, and lab correlation.
  • Strong understanding of heat transfer, conduction, convection, thermal resistance networks, airflow management, thermal interface materials, heat sinks, heat spreaders, and temperature measurement techniques.
  • Experience designing mechanical solutions around PCBs, high‑speed/PCIe cards, sockets, connectors, FPGA packages, board stiffeners, retention hardware, and system‑level interfaces.
  • Working knowledge of tolerance analysis, DFM/DFA, material selection, and manufacturing processes such as CNC machining, sheet metal, injection molding, die casting, and additive manufacturing.
  • Proven ability to lead technical work across multiple projects, make sound engineering trade‑offs, and communicate effectively with global cross‑functional teams and external suppliers.
  • Ability to travel occasionally to support prototype builds, supplier engagements, design reviews, and validation activities.
Preferred Qualifications
  • Experience with FPGA development kits, engineering validation boards, reference platforms, accelerator cards, or semiconductor evaluation systems.
  • Experience developing high‑power heatsink assemblies, fan/duct solutions, heat pipes, vapor chambers, cold plates, or conduction‑cooled platforms.
  • Familiarity with thermal, structural, vibration, shock, acoustic, EMC/EMI, safety, and environmental requirements for electronics hardware.
  • Experience with design verification plans, validation methods, DOE, test instrumentation, thermal chambers, data acquisition, and engineering change processes.
  • Proficiency with 2D drafting and drawing standards, PLM/PDM systems, Microsoft Office automation, and technical data/reporting tools.
  • Experience mentoring engineers, setting design guidelines, reviewing technical work, and influencing platform architecture without direct authority.
Job Type

Job Type: Regular Shift: Shift 1 (Malaysia)

Primary Location

Primary Location: Penang 15, Penang, Malaysia

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

About Altera

Altera: Accelerating Innovators Altera provides leadership programmable solutions that are easy‑to‑use and deploy in applications from cloud to edge, offering limitless AI possibilities. Our end‑to‑end broad portfolio of products including FPGAs, CPLDs, Intellectual Property, development tools, System on Modules, SmartNICs and IPUs provide the flexibility to accelerate innovation. Altera is helping to shape the future through pioneering innovation that unlocks extraordinary possibilities for everyone on the planet.

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