Senior Equipment Engineer (Molding)

Nexperia Malaysia Sdn.Bhd.; Seremban; On-site; MYR 100,000 - 120,000; Full time

Job summary

A leading semiconductor company in Malaysia is seeking a Senior Equipment Engineer (Molding) to ensure the reliability and improvement of molding equipment in a high-volume manufacturing environment. The role involves leading maintenance and optimization efforts, collaborating with cross-functional teams, and mentoring technicians. Ideal candidates will have at least 5 years of semiconductor experience and strong hands-on knowledge of molding processes. This position offers a dynamic work environment with a focus on innovation and continuous improvement.

Benefits

Inclusive workplace

Employee resource groups

Qualifications

• Minimum 5 years of experience in the semiconductor industry, with at least 3 years specializing in EMC molding equipment or processes.
• Strong understanding of mold compound properties and interactions with other assembly materials.
• Proven leadership skills with experience managing technicians in a 24/7 manufacturing environment.

Responsibilities

• Lead the maintenance and optimization of molding equipment across various semiconductor package types.
• Monitor equipment downtime and develop mitigation plans using MTBF/MTBA analysis.
• Collaborate with cross-functional teams to develop and update technical documentation.

Skills

Hands-on experience with compression or transfer molding

Proficiency in statistical analysis tools (JMP, Minitab)

Excellent problem-solving skills

Strong cross-functional collaboration

Education

Bachelor’s degree in engineering or related technical discipline

Tools

JMP

Minitab

Job description

Senior Equipment Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross‑functional teams including Process Engineering, R&D, NPI, and Product Design.

Responsibilities

• Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
• Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy‑off.
• Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high‑volume manufacturing (HVM).
• Collaborate with cross‑functional teams to develop, maintain, and update technical documentation, including control plans, process specifications, SOPs, FMEAs, and technical reports.
• Plan and manage technician headcount to support 24/7 manufacturing operations; delegate tasks efficiently and provide clear, transparent updates to stakeholders.
• Mentor and coach technicians to strengthen technical competency and engineering mindset, including KPI setting and annual performance reviews.
• Work closely with R&D, NPI, Product Design, and Reliability teams to align molding equipment capability with package architecture and process requirements.
• Diagnose and resolve molding‑related equipment and process issues impacting yield and reliability.
• Support technology, process, and equipment transfer activities and ensure smooth ramp‑up to HVM.
• Contribute to process technology roadmaps for advanced packaging, thin‑form‑factor solutions, and emerging device architectures.
• Drive continuous improvement initiatives such as MVA, yield improvement, and UPH optimization.
• Manage spare parts inventory, procurement activities, and vendor engagement.
• Liaise with suppliers and vendors for jig and fixture fabrication and closely monitor delivery schedules for spare and non‑spare parts.
• Thrive in a fast‑paced, high‑volume manufacturing environment while maintaining high standards of equipment performance and reliability.

Qualifications

• Bachelor’s degree in engineering or a related technical discipline.
• Minimum 5 years of experience in the semiconductor industry, with at least 3 years specializing in EMC molding equipment or processes.
• Strong hands‑on experience with compression or transfer molding, including thin flat mold, exposed pad, and multi‑die packages.
• Proficiency in statistical analysis tools such as JMP and Minitab, with solid technical documentation skills.
• Strong understanding of mold compound properties, material flow behavior, curing characteristics, and interactions with other assembly materials (added advantage).
• Proven leadership skills with experience managing technicians in a 24/7 manufacturing environment.
• Excellent problem‑solving, communication, and cross‑functional collaboration skills.

As an equal‑opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Nexperia is a world‑class company in semiconductor development and in‑house production. A proven global player with an entrepreneurial mentality. At our core is an 11,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.