Senior Engineer Equipment Engineering Die Attach

Infineon Technologies AG; Malacca City; On-site; MYR 50,000 - 90,000; Full time

Job summary

Infineon Technologies AG is seeking a dedicated engineer to drive planned maintenance and equipment performance in Malacca City. The role involves leading maintenance teams, managing costs, and implementing improvements in semiconductor manufacturing processes. Candidates should possess a relevant engineering degree and have knowledge in Die Bond and SMT processes, along with a strong background in mechanical engineering.

Qualifications

• Masters/Bachelor’s Degree in Engineering (Mechanical/Electrical/Electronics/Microelectronics/Mechatronics/Semiconductor Technology) required.
• Knowledge in Die Bond and SMT process is a plus.
• Ability to build high-performance teams.

Responsibilities

• Drive planned maintenance definition and lead maintenance teams.
• Manage maintenance costs and develop governance frameworks.
• Encourage culture of equipment improvement.

Skills

Knowledge in Die Bond process

Mechanical engineering background

Manufacturing knowledge

Familiar with SMT equipment

Education

Masters/Bachelor’s Degree in Engineering

Job description

To drive Die Bond/SMT planned maintenance systematic & methodology to ensure machine performance at the optimum condition. Execute equipment improvement and governance.

Job Description
In your new role you will:

• Drive and build planned maintenance definition with high availability, good reliability and appropriate quality performance.
• Lead the planned maintenance teams and maintenance technician groups to execute equipment scheduled maintenance timely and comprehensively and define the parts life span and consumption.
• Advanced Process Control Key numbers definition, pilot, implement, cascading at equipment platform
• Manage maintenance cost in sustaining the equipment to it fullest performance.
• Develop and execute EQ governance business process/framework.
• Drive a culture based of equipment improvement on maintenance routines and engineering solutions using training, systematic troubleshooting and root cause corrective actions.

Your Profile
You are best equipped for this task if you have:

• Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical/Electronics / Microelectronics / Mechatronics / Semiconductor Technology) or equivalent.
• Knowledge in Die Bond process, SMT process will be plus point.
• Possess a broad background in mechanical engineering / manufacturing with a wide range of knowledge on manufacturing and production processes.
• Familiar with the latest equipment / technology in the industry and able to upgrade/ improve existing equipment to suit the business needs
• Familiar with SMT equipment.
• Ability to build a high performance team who can operate efficiently, effectively, productively and cost effectively.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

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