Process and Equipment Tech

NXP Semiconductors; Kuala Lumpur; On-site; MYR 30,000 - 60,000; Full time

Job summary

An established industry player is seeking a Plating Process Technician and a Plating Equipment Technician to join their team. In these roles, you will be responsible for setting up and maintaining plating lines, ensuring chemical addition based on lab analysis, and performing regular maintenance on plating machines. Candidates should have a diploma in engineering and previous experience in electroplating within semiconductor assembly. This is an exciting opportunity to contribute to innovative processes in a dynamic environment where your skills will directly impact production quality and efficiency.

Qualifications

• Experience in electroplating within semiconductor assembly is essential.
• Diploma in relevant engineering fields is required.

Responsibilities

• Set up and maintain plating lines according to specifications.
• Perform maintenance on plating machines and related equipment.

Skills

Electroplating

Chemical Analysis

Maintenance Skills

Education

Diploma in Engineering (Chemical, Mechanical)

Diploma in Engineering (Electric/Electronic, Mechanical)

Tools

Plating Machines

Plating Pumps

Rectifiers

Job description

Plating Process Technician

Carry out the following activities:

1. Set up Plating Line as per process specifications.
2. Set up recipes based on product requirements.
3. Set up and maintain plating baths and miscellaneous related equipment related to electroplating.
4. Responsible for chemical addition based on lab analysis.
5. Chemical Filtration & Leaching activity.
6. Anode Top Up for respective plating lines.

Requirement:

1. Diploma in Engineering (Chemical, Mechanical) or related.
2. Previous experience in electroplating in semiconductor assembly.

Plating Equipment Technician

Carry out the following activities:

1. Set up Plating Line Loader and Unloader.
2. Change Over of Loader and Unloader.
3. Carry out periodical maintenance for plating machines.
4. Maintenance of plating machine fittings.
5. Replacement of Plating Pumps and Rectifiers.
6. Serving Pumps and Blowers.

Requirement:

1. Diploma in Engineering (Electric/Electronic, Mechanical) or related.
2. Previous experience in electroplating in semiconductor assembly.