Manufacturing Process Lead Engineer

Celestica; Kulai; On-site; MYR 251,000 - 357,000; Full time

Job summary

A multinational electronics manufacturer is seeking a highly experienced Senior Engineer specializing in Printed Circuit Board Assembly (PCBA) in Johor, Malaysia. This role involves driving New Product Introduction (NPI) processes while optimizing quality and cost efficiency. The ideal candidate will leverage technical expertise to address complex challenges and collaborate with cross-functional teams, ultimately improving production yield and implementing Lean initiatives. A Bachelor’s degree and 5+ years in PCBA manufacturing are required.

Benefits

Equal opportunity employer

Inclusive work environment

Career development opportunities

Qualifications

• 5+ years of hands-on experience in PCBA manufacturing and New Product Introduction.
• Proven track record in yield improvement and cost reduction.
• Expert-level knowledge of PCBA assembly processes.

Responsibilities

• Drive the technical execution of NPI activities for PCBA.
• Collaborate with internal teams and suppliers on DFM/DFT requirements.
• Lead Root Cause Analysis for complex PCBA failures.

Skills

Problem-solving

Cross-functional collaboration

Data-driven decision-making

Analytical skills

Education

Bachelor's degree in Electrical/Electronic Engineering or related

Master's degree preferred

Tools

IPC standards (IPC-A-610, IPC-7351)

Six Sigma

Lean methodologies

Job description

Overview

Req ID: 127649 | Remote Position: No | Region: Asia | Country: Malaysia | State/Province: Johor | City: Senai

We are looking for a highly experienced Senior Engineer specializing in Printed Circuit Board Assembly (PCBA) to drive and execute process improvements with a strong focus on New Product Introduction (NPI), preferably from High-Mix Low-Volume (HMLV) manufacturing environments.

The ideal candidate will leverage deep technical expertise to optimize PCBA processes, ensure scalable and high-quality solutions, and champion continuous improvement in yield, quality, and cost efficiency as an individual contributor and technical leader.

Responsibilities

Manufacturing Process Engineering & NPI Execution

• Drive the technical execution of end-to-end NPI activities for PCBA, ensuring a robust and smooth transition from design to mass production.
• Collaborate closely with the Internal DFM team, customers, manufacturing peers, and suppliers to ensure all DFM/DFT (Design for Manufacturing/Test) requirements are defined, met, and successfully implemented.
• Apply advanced problem-solving skills to resolve complex technical challenges and production bottlenecks during prototyping, pilot runs, and production ramp-up.

High-Mix Low-Volume (HMLV) Process Expertise

• Technically own and optimize PCBA processes for HMLV environments, ensuring maximum flexibility, high uptime, and efficiency.
• Execute technical tasks related to BOM scrubbing, component obsolescence resolution, and alternate component qualification.
• Partner with the internal equipment team to define, implement, and qualify processes that enable quick changeovers and minimal equipment downtime.

Yield & Quality Improvement

• Develop, implement, and qualify technical process improvements such as PFMEA, poka-yoke mechanisms, and custom tooling (Jigs/fixtures) to achieve world-class first-pass yield.
• Lead and execute deep-dive Root Cause Analysis (RCA) for complex PCBA failures and drive the implementation of robust corrective and preventive actions (CAPA).
• Establish, monitor, and report on key process and quality metrics, and champion continuous improvement initiatives utilizing methodologies like Six Sigma and Lean.

Cost-Saving & Lean Initiatives

• Identify, champion, and technically execute cost-reduction opportunities in material, process, and overhead areas without compromising quality or reliability.
• Implement Lean manufacturing principles and tools (e.g., Value Stream Mapping) to eliminate process waste within PCBA production lines.
• Optimize process yield to significantly reduce bonepile/scrap inventory, directly supporting HMLV inventory management goals.

Cross-Functional Collaboration & Technical Communication

• Serve as the primary technical subject matter expert for PCBA processes within the organization.
• Work closely with Test Engineering, Operations (Production), and QA teams to ensure process robustness, control, and product reliability.
• Prepare and present technical data, project status, and key process findings to cross-functional stakeholders.

Knowledge/Skills/Competencies

Education & Experience

• Bachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, or a related technical field. Master’s degree preferred.
• 5+ years of hands-on, progressive experience in PCBA manufacturing and New Product Introduction (NPI).
• Proven track record of technical execution in HMLV manufacturing, yield improvement, and cost reduction.
• Expert-level, practical working knowledge of IPC standards (IPC-A-610, IPC-7351) and all aspects of the PCBA assembly process (Stencil Printing, SMT, Reflow, Wave, Selective Soldering, AOI/AXI).
• Demonstrated proficiency in applying methodologies such as Six Sigma, Lean, and Kaizen to solve complex technical problems.

Soft Skills

• Exceptional analytical problem-solving skills and a strong sense of technical ownership.
• Effective cross-functional collaboration and communication skills.
• Highly data-driven and detail-oriented approach to decision-making.

Preferred Qualifications

• Deep technical experience in developing and sustaining manufacturing processes for PCBA assembly.
• Technical knowledge of thermal/mechanical stress analysis for reliability assessment.
• Background in Industrial and Test measurement product compliance and qualification.

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.

Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).

At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.

COMPANY OVERVIEW:
Celestica (NYSE, TSX: CLS) enables the world’s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.

Celestica would like to thank all applicants, however, only qualified applicants will be contacted. Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.