Manufacturing Process Engineer Electronics & Wire Bonding

Coherent Corp.; Ipoh; On-site; MYR 60,000 - 85,000; Full time

Job summary

A leading manufacturing firm in Perak, Malaysia is seeking an expert Engineer to improve Die Attach and Wire Bond processes. Candidates should have a Bachelor's in Electronics or Electrical Engineering and experience in high volume manufacturing. Strong analytical skills and proficiency in process optimization tools like JMP and Minitab are essential. The role offers a competitive compensation package and career growth opportunities in a dynamic work environment.

Benefits

Competitive compensation

Career development opportunities

Qualifications

• Experience in high mix and high volume manufacturing.
• Good knowledge of process problem solving analysis.
• Strong analytical skills with hands-on machine troubleshooting.

Responsibilities

• Responsible for sustaining & improving the Die Attach & Wire Bond Process.
• Monitor and maintain Assembly yield within KPI targets.
• Develop Manufacturing Work Instructions and implement Engineering change orders.

Skills

Failure Mode and Effects Analysis (FMEA)

Manufacturing Processes

JMP

Wire Bonding

Minitab

Die

Education

Bachelor of Science/ Engineering majoring in Electronics or Electrical

Tools

SAS JMP

Minitab

Job description

A leading manufacturing firm in Perak, Malaysia is seeking an expert Engineer to improve Die Attach and Wire Bond processes. Candidates should have a Bachelor's in Electronics or Electrical Engineering and experience in high volume manufacturing. Strong analytical skills and proficiency in process optimization tools like JMP and Minitab are essential. The role offers a competitive compensation package and career growth opportunities in a dynamic work environment.