Engineer Quality

Infineon Technologies AG; Malacca City; On-site; MYR 60,000 - 90,000; Full time

Job summary

A leading semiconductor company in Malacca is seeking an experienced Engineer to take ownership of reliability functions in package development projects. The ideal candidate has a degree in Engineering or Science, at least one year of experience in the semiconductor industry, and strong analytical and communication skills. This role offers a chance to innovate in a diverse work environment.

Qualifications

• Minimum of 1 year of experience in reliability engineering within the semiconductor industry.
• Fluent in English with proficiency in technical writing.
• Hands-on experience in data analysis and statistical methods.

Responsibilities

• Owner of Reliability Functions for package development projects.
• Implementing major reliability tests according to project scope.
• Deriving comprehensive reports from reliability stress test samples.

Skills

Reliability Engineering

Analytical skills

Problem-solving

Communication

Technical writing

Education

Master’s / Bachelor’s Degree in Engineering or Science

Job description

We are seeking a highly skilled and experienced Engineer to take ownership of reliability functions in package development projects, ensuring robust performance and successful product qualification.

Job Description
In your new role you will:

• Owner of Reliability Functions for package development projects with high competency in five core relevant Fields of Knowledge.
• First Level Reliability – Good comprehension of first-level reliability test objectives, requirements, and parameters, with proficiency in international specifications (JEDEC, AEC, IPC).
• Package Integrity Tests – Proficient in implementing major reliability tests according to project scope and requirements, based on project Delta Analysis, FMEA, etc.
• Internal Package Analysis – Basic understanding of FA analysis tools and methods, with the ability to implement them on completed reliability stress test samples. Capable of deriving comprehensive reports and providing RQ expertise in proposals and recommendations.
• Chip/Package/Board Co-Design – Proficient in CPiB and its implementation for robust packaging reliability execution and qualification, leading to successful product release.

Your Profile
You are best equipped for this task if you have:

• Master’s /Bachelor’s Degree in Engineering (Electrical, Electronics, Microelectronics, Mechatronics, Semiconductor Technology) or Science (Chemistry, Physics, Materials).
• Minimum of 1 year of working experience in reliability engineering within the semiconductor industry. Graduates are encouraged to apply.
• Excellent analytical and problem-solving skills, with the ability to derive actionable insights from data.
• Strong communication and collaboration skills, able to work effectively with cross-functional teams.
• Fluent in English with proficiency in technical writing and reporting.
• Hands-on experience in data analysis, statistical methods, and database handling.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.