Engineer (Middle Assembly Line)

Renesas Electronics (Malaysia); Teluk Panglima Garang; On-site; MYR 90,000 - 140,000; Full time

Job summary

Renesas Electronics (Malaysia) seeks an experienced engineer to develop, optimize, qualify, and transfer semiconductor assembly processes across Molding, IR Reflow, and Plating. You will collaborate across NPI, Production, and Quality to ensure reliable mass production readiness and product quality.

The role emphasizes process development, optimization, and issue resolution, with cross-functional teamwork to mitigate risks and meet project milestones.

Qualifications

• Bachelor's degree in Engineering or related field required.
• Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering in MOL processes (Molding–Plating).
• Experience in multiple assembly processes, especially power semiconductor packaging, is a plus.

Responsibilities

• Develop, establish, and optimize assembly process conditions for new products in Molding, Reflow & Plating.
• Prepare and execute process development plans, qualification builds, and validation activities.
• Establish process parameters, specifications, control limits, and acceptance criteria.
• Evaluate process feasibility, identify manufacturing risks, and implement preventive actions before mass production.
• Review process capability, yield, defect trends, and qualification results.
• Coordinate readiness and documentation before qualification and mass production.

Skills

Analytical skills

Troubleshooting

Problem solving

DOE knowledge

SPC knowledge

FMEA knowledge

Excel & PowerPoint

Communication skills

NPI management

Education

Bachelor's Degree in Engineering (Materials/Manufacturing)

Tools

Towa molding machine

Plating machine

JMP analysis tools

Job description

To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering Molding, IR Reflow & Plating. The role is responsible for process development, optimization, qualification, technical problem-solving, and manufacturing readiness to ensure new products meet quality, reliability, productivity, and cost requirements.

The engineer will work closely with NPI project management, Production, Process Engineering, Equipment Engineering, Quality Assurance, Product Engineering, Material Engineering, and other cross-functional teams to ensure successful product introduction and smooth transfer to mass production.

Key Responsibilities

A. NPI Process Development and Qualification

• Develop, establish, and optimize assembly process conditions for new products in Molding , Reflow & Plating process.
• Prepare and execute process development plans, engineering & qualification builds, and process validation activities.
• Establish process parameters, specifications, control limits, and acceptance criteria.
• Evaluate process feasibility, identify potential manufacturing risks, and implement preventive actions before mass production.
• Review process capability, yield performance, defect trends, and qualification results.
• Prepare technical reports, process documentation, and qualification summaries.
• Support safe launch activities and ensure all critical process issues are resolved before mass production release.

B. Multi-Process Engineering Responsibilities

• Molding & PMC - Develop and optimize Molding process and other related process control for Molding.
• IR Reflow - Develop and optimize IR Reflow process for new product
• Plating & bake - Develop and optimize Plating parameters and other related process control for Plating process

C. Cross-Functional Collaboration

• Collaborate with Production, Equipment Eng, QA, Product Eng, Material Eng, and other relevant departments
• Work with equipment and material suppliers to evaluate new technologies and improvement opportunities.
• Provide technical support during engineering builds, qualification builds, troubleshooting, and production ramp-up.
• Coordinate process readiness, material availability, and documentation before qualification and mass production.

D. Documentation and Mass Production Transfer

• Prepare and maintain process specifications, SOPs, work instructions, process flow documents, and risk assessments.
• Maintain engineering records, process parameter histories, DOE results, and qualification reports.
• Support PFMEA reviews and implementation of appropriate process controls.
• Define critical-to-quality parameters and monitoring requirements.

Qualifications

• Bachelor's Degree in Engineering (Major in Materials, Chemical , Manufacturing, or related disciplines).
• Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering is preferred in MOL processes (Molding~Plating)
• Candidates with relevant experience in multiple assembly processes, particularly power semiconductor or power discrete packaging, will have an added advantage.

Skills and Knowledge

• Strong analytical, troubleshooting, and problem-solving skills.
• Good understanding of semiconductor assembly processes and process interactions.
• Knowledge of DOE, SPC, process capability analysis, FMEA, and structured root cause analysis.
• Ability to interpret engineering data, identify process risks, and implement effective corrective actions.
• Proficiency in Microsoft Excel and PowerPoint for data analysis, technical reporting, and presentation
• Good communication and cross-functional collaboration skills.
• Ability to manage multiple NPI activities and meet project milestones.

Added Advantages

• Experience in SAW QFN, MOSFET, power discrete, or power semiconductor package assembly.
• Hands-on experience to operate on Towa molding machine & Plating machine.
• Experience in solder joint inspection, void analysis, X-ray inspection, cross-section analysis, and package failure analysis.
• Experience in new product qualification, process transfer, safe launch, and mass production ramp-up.
• Experience in process development using DOE and optimization of multi-step assembly processes using JMP analysis tools.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read ourDiversity & Inclusion Statement.

Renesas empowers a safer, smarter and more sustainable future where technology helps make our lives easier.

A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.