Engineer Development

Infineon Technologies AG; Malacca City; On-site; MYR 40,000 - 60,000; Full time

Job summary

A leading semiconductor solutions provider in Malacca is seeking a dedicated individual for the Die Attach Process role. You will be responsible for setting up processes, qualifying them to meet specifications, and developing new technologies. A Bachelor's degree in Engineering is required, along with knowledge of die attach processes. This role encourages fresh graduates and offers an inclusive work environment.

Qualifications

• Knowledge of die attach process and skills in AI or digitalization will be considered an advantage.
• More than one year of experience in Assembly Packaging or a background in Semiconductor Manufacturing is preferred.
• Fresh graduates are welcome to apply.

Responsibilities

• Establish new Die Attach processes and recipes.
• Qualify processes to meet Critical to Quality Requirements.
• Develop new processes for emerging wafer technologies.

Skills

Knowledge of die attach process

Skills in artificial intelligence (AI)

Basic knowledge of statistics

Basic problem-solving skills

Education

Bachelor's degree in Mechanical, Manufacturing, or related Engineering field

Job description

Responsible for setting up the Die Attach Process Recipe and process parameters.

Job Description

In your new role you will:

• Establish new Die Attach processes and recipes, conduct comprehensive window studies, Design of Experiments (DOEs), and define specification limits.
• Qualify processes to meet Critical to Quality Requirements, including CPK, perform full risk assessments, assess Units Per Hour (UPH), and engage in problem-solving.
• Develop new processes for emerging wafer technologies, next-generation products, and new materials or tooling.
• Ensure a smooth transition of processes for new device or product induction into High Volume Manufacturing (HVM).
• Documentation includes Work Instructions (WI), Standard Operating Procedures (SOP), Out-of-Control Action Plans (OCAP), Process Design Reviews (PDR), Failure Modes and Effects Analysis (FMEA), Control Plans, and 8D reports.

Your Profile

You are best equipped for this task if you have:

• Bachelor's degree in Mechanical, Manufacturing, or a related Engineering field.
• Knowledge of the die attach process and skills in artificial intelligence (AI) or digitalization will be considered an advantage.
• More than one year of experience in Assembly Packaging or a background in Semiconductor Manufacturing is preferred.
• Fresh graduates are welcome to apply.
• Basic knowledge of statistics and Statistical Process Control (SPC) is required.
• Basic problem-solving skills are also necessary.

We are a global leader in semiconductor solutions in power systems and IoT, enabling game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals.

We embrace diversity and inclusion and welcome everyone for who they are. We offer a working environment characterized by trust, openness, respect, and tolerance and are committed to giving all applicants and employees equal opportunities.