Engineer Design

Infineon Technologies AG; Malacca City; On-site; MYR 50,000 - 70,000; Full time

Job summary

A leading semiconductor company in Malacca is seeking a designer to perform design and drafting for package and lead frame development. Responsibilities include using AutoCAD and Inventor to create 3D models and ensuring compliance with project milestones. Candidates should have a background in semiconductor packaging and strong analytical skills.

Qualifications

• Basic semiconductor packaging, assembly and test.
• Material development, analysis, qualification and reliability.
• Drafting/designing (2D/3D) semiconductor package using AutoCAD/Inventor.

Responsibilities

• Use AutoCAD and Inventor for package development.
• Modify 2D and 3D outputs.
• Drive package/leadframe 3D design development.

Skills

AutoCAD

Inventor

Analytical skills

Problem-solving skills

Strong mathematic knowledge

GD&T knowledge

Tools

CAD Desktop

SAP

Job description

Perform design and drafting drawing and specification for package and lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.

Job Description

In your new role you will:

• Use of AutoCAD and Inventor tool in package development cycle. Understanding design systematics, creating 3D models and parametric control.
• Use of CAD Desktop and SAP in Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop as well as Metadata, revisioning, file linkages, and derivations.
• Design method and design flow of new package and leadframe based on technical capabilities of materials, processes and suppliers.
• Modified 2D and 3D output.
• Drive Package / leadframe 3D design development activities and ensure fulfilment of project milestone deliverables and documentation release (spec, drawing, SAP)
• Liaise with leadframe engineer to ensure fulfilment of all leadframe specification and requirement.

Your Profile

You are best equipped for this task if you have:

• Basic semiconductor packaging, assembly and test.
• Material development, analysis, qualification and reliability.
• Analytical and problem solving skills.
• Strong mathematic knowledge (Algebra, trigonometry & etc) for Inventor parametric.
• GD&T knowledge / material specification definition.
• Drafting / designing (2D/3D) semiconductor package (Mold Body, Wire, Chip, Solder & etc) using AutoCAD / Inventor.

We are committed to diversity and inclusion and welcome everyone for who they are. Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities.