Die Attach Process Engineer - Optimize Bonding & Yield

STMicroelectronics; Muar; On-site; MYR 100,000 - 150,000; Full time

Job summary

A leading global semiconductor company is seeking an engineering graduate for process optimization and die bonding improvements. The successful candidate will troubleshoot line issues, enhance machine reliability, and collaborate within teams to resolve production challenges. Strong analytical, communication skills, and proficiency in MS Excel are essential. This role offers the chance to work in a diverse and inclusive environment, contributing to innovative technology solutions.

Qualifications

• Bachelor’s or master's degree in engineering (Electrical, Mechanical, Material Engineering or related field).
• Strong team player with the ability to collaborate across functions.
• Excellent command of English (both spoken and written).

Responsibilities

• Lead for process optimization and improvement for die bonding process.
• Perform die attach related line issue troubleshooting.
• Develop and fine tune camera vision parameters.

Skills

Analytical skills

Team collaboration

Problem-solving

Communication skills

Education

Bachelor’s or master's degree in engineering

Tools

MS Excel

PowerPoint

Job description

A leading global semiconductor company is seeking an engineering graduate for process optimization and die bonding improvements. The successful candidate will troubleshoot line issues, enhance machine reliability, and collaborate within teams to resolve production challenges. Strong analytical, communication skills, and proficiency in MS Excel are essential. This role offers the chance to work in a diverse and inclusive environment, contributing to innovative technology solutions.