Die Attach Engineer/Senior Engineer - (Soft Solder / NPI)

STMicroelectronics; Johor; On-site; MYR 200,000 - 250,000; Full time

Job summary

A leading semiconductor company in Johor, Malaysia is looking for a qualified engineer to develop and industrialize new die attach processes and materials for lead frame packages. The ideal candidate should have a degree in Mechanical or Electronics Engineering, experience in soft solder processes, and strong troubleshooting skills. This role involves supporting package qualifications and providing technical assistance for manufacturing concerns.

Qualifications

• Experience with soft solder process is an added advantage.
• Ability to work well under pressure.

Responsibilities

• Develop and industrialize new die attach processes & materials for lead frame packages.
• Qualify new packages, products, and die attach technology.
• Support qualification and engineering samples for new packages or technologies.
• Review and update process specification, FMEA, OCAP, and process control plans.
• Provide technical support for critical quality concerns.

Skills

Technical knowledge on process and material know-how

Analytical troubleshooting

Interpersonal skills

Design of Experiment (DOE) skills in SAS-JMP

Education

Master’s or bachelor’s degree in Mechanical engineering / Material Science / Electrical Engineering / Electronics Engineering

Job description

Responsibilities

• To develop and to industrialize new die attach process & material (Soft Solder, Die Attach Glue, Die Attach Film) for new lead frame packages, to meet the yield and quality requirement.
• To qualify new package, products and new die attach technology.
• To support Qualification/ Engineering samples for new packages, new products or new technologies.
• To review and update Process Specification, FMEA, OCAP and Process Control Plan.
• To provide technical support when there is critical quality concern related to Die Attach material or process.

Qualifications

• Master’s or bachelor’s degree in Mechanical engineering / Material Science / Electrical Engineering / Electronics Engineering or equivalent engineering field.
• Candidate with soft solder process experience will be an added advantage.
• Strong technical knowledge on process and material know-how.
• Skill in Design of Experiment (DOE) in SAS-JMP will be added advantage.
• Skill in analytical troubleshooting.
• Good interpersonal skills and able to work well under pressure.