Automotive Packaging Reliability & Qualification Lead

Infineon Technologies; Malacca City; On-site; MYR 250,000 - 300,000; Full time

Job summary

A leading semiconductor company in Malaysia is seeking an experienced Automotive Package Development Engineer to support package development projects aligned with automotive goals. The role involves collaboration with teams, process development, and training design. The ideal candidate has a degree in Electrical Engineering, expertise in assembly processes, strong problem-solving skills, and familiarity with methodologies like FMEA. Join a company committed to innovation and diversity.

Qualifications

• Extensive experience in semiconductor assembly processes with strong understanding of wafer technology.
• Proven experience in unit process development and package definition.
• Exceptional ability to listen and communicate technical information effectively.

Responsibilities

• Provide technical support and review package development projects.
• Develop and implement methods and processes for automotive package development.
• Design and deliver training materials to support automotive development goals.
• Offer expert support on robustness and reliability of packages.

Skills

Expertise in Assembly Processes

Strong Communication Skills

Problem-Solving Capabilities

Familiarity with Methodologies

Education

University Degree in Electrical Engineering or related field

Job description

A leading semiconductor company in Malaysia is seeking an experienced Automotive Package Development Engineer to support package development projects aligned with automotive goals. The role involves collaboration with teams, process development, and training design. The ideal candidate has a degree in Electrical Engineering, expertise in assembly processes, strong problem-solving skills, and familiarity with methodologies like FMEA. Join a company committed to innovation and diversity.