Assembly Media and Collaterals Development Engineer

Intel; Kulim; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading technology company in Malaysia is seeking a Mechanical Engineer to develop and optimize assembly processes for advanced packaging technologies. Candidates should possess a Bachelor's or Master's degree in Engineering or Physics, with at least 2 years of relevant experience in engineering concepts. Knowledge of Statistical Process Control and design software is essential. The position offers opportunities for innovative solutions and continuous improvement in manufacturing processes.

Qualifications

• Minimum 2+ years of experience in science and engineering concepts.
• Experience with analytics and design tools in the packaging industry.
• Strong knowledge of engineering drawing and tolerancing analysis.

Responsibilities

• Develop assembly processes and equipment for future technologies.
• Optimize manufacturing efficiency for quality and cost.
• Ensure manufacturability and oversee product processes.

Skills

Statistical Process Control (SPC)

Design of Experiments (DOE)

Mechanical design software

Education

Bachelor's or Master's in Engineering or Physics

Tools

SolidWorks

AutoCAD

Job description

Job Details:

Responsibilities

• Develop assembly processes and equipment, applying novel concepts for Intel's roadmap of future assembly packaging platform technologies.
• Optimize and improve manufacturing efficiency of packages, meeting quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications using design of experiments and data analysis, documenting improvements through white papers.
• Maintain equipment to evaluate silicon and package technologies under simulated field use conditions (heat, humidity, temperature cycle, dynamic forces).
• Ensure manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures, and flows.
• Establish material specifications for contract assemblers and raw material vendors, interfacing with supplier quality and procurement teams to ensure material quality and vendor performance through strict adherence to process specifications and existing product qualification methods.
• Develop new techniques and acceleration methods, tools, and quality screens to identify potential packaging quality and reliability problems early.
• Set reliability requirements to meet customer needs, influencing design, material selection, and process development based on failure mechanism understanding.
• Lead efforts to innovate, problem solve, develop, and continuously improve equipment and processes using experimental design and statistical methods.
• Provide consultation concerning packaging problems and improvements, responding to customer/client requests or events as they occur.
• Deliver standardization in product qualification, manufacturing quality systems, and methods, continuously engaging with packaging technology development and partner engineering groups on process/technology maturity for products toward key risk areas in meeting product milestones.

Qualifications

Minimum Qualifications:

• Bachelor's or Master's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or Physics.
• Minimum 2+ years of experience in fundamental science and engineering concepts, with strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Experience with analytics and design tools in the packaging industry (AutoCAD, SolidWorks, etc).
• Experience with engineering drawing, tolerancing analysis, and design rules.

Preferred Qualifications:

• Strong mechanical design software experience (SolidWorks, AutoCAD, etc).
• Portfolio of self‑completed concept to fabrication project examples (assembly equipment, process, media, and/or collateral).
• Technical innovation and delivery of results for complex, time‑critical technical projects.
• Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to our staffing team at [e-mail].

All qualified applicants will receive consideration for employment without regard to race, color, religion, sexual orientation, gender identity, gender expression, gender expression, gender identity, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, or any other characteristic protected by local law, regulation, or ordinancep>